Inventor · disambiguated record
Toshihisa Nonaka
Also filed as: NONAKA TOSHIHISA
16 granted patents·11 pending applications·94 citations·filing 1988–2021
91Inventor score
Top patents by PatentIndex Score
27 records- 0179US6406771B1Optical recording medium and optical recording apparatusTORAY INDUSTRIES·Filed 2000·Granted Jun 18, 2002·17 cites·9 claims
- 0277US7960462B2Paste composition for light guide and light guide utilizing the sameTORAY INDUSTRIES·Filed 2007·Granted Jun 14, 2011·3 cites·9 claims
- 0374US9058912B2Paste composition and dielectric composition using the sameHARA YOSHITAKE·Filed 2010·Granted Jun 16, 2015·5 cites·8 claims
- 0465US4920093AFabrication of superconducting oxide thin films by sol-gel methodTORAY INDUSTRIES·Filed 1988·Granted Apr 24, 1990·24 cites·32 claims
- 0563US8653202B2Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor deviceFUJIMARU KOICHI·Filed 2006·Granted Feb 18, 2014·5 cites·5 claims
- 0658US9591768B2Adhesive agent having a polyimide and acid modified rosinTORAY INDUSTRIES·Filed 2013·Granted Mar 7, 2017·1 cites·8 claims
- 0758US6352753B2Optical recording mediumTORAY INDUSTRIES·Filed 1999·Granted Mar 5, 2002·15 cites·20 claims
- 0857US7444058B2Resin composition for optical wiring, and optoelectronic circuit boardTORAY INDUSTRIES·Filed 2007·Granted Oct 28, 2008·2 cites·18 claims
- 0952US5001110AOrganometallic solutions for forming oxide superconducting filmsTORAY INDUSTRIES·Filed 1989·Granted Mar 19, 1991·13 cites·10 claims
- 1047US2024018306A1Resin composition, method for producing semiconductor device, cured product, semiconductor device, and method for synthesizing polyimide precursorRESONAC CORP·Filed 2021·Application pending·0 cites
- 1145US11049825B2Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jun 29, 2021·0 cites·10 claims
- 1245US2009103236A1Paste composition, dielectric composition, capacitor, and method for production of paste compositionNONAKA TOSHIHISA·Filed 2006·Application pending·0 cites
- 1344US9738763B2Resin composition, resin sheet, and production method for semiconductor deviceTORAY INDUSTRIES·Filed 2014·Granted Aug 22, 2017·0 cites·12 claims
- 1441US2015072477A1Adhesive sheet for production of semiconductor device with bump electrode, and method for production of semiconductor deviceTORAY INDUSTRIES·Filed 2013·Application pending·0 cites
- 1541US2012181709A1Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor device using the sameSHIMADA AKIRA·Filed 2010·Application pending·0 cites
- 1640US10050005B2Semiconductor resin composition, semiconductor resin film, and semiconductor device using the sameTORAY INDUSTRIES·Filed 2014·Granted Aug 14, 2018·0 cites·14 claims
- 1740US5840466AOptical recording media and their production methodsTORAY INDUSTRIES·Filed 1995·Granted Nov 24, 1998·9 cites·7 claims
- 1840US2015107764A1Process for producing adhesive sheet having singulated adhesive layer, process for producing wiring substrate using the adhesive sheet, method of manufacturing semiconductor equipment, and equipment for producing adhesive sheetKATAYAMA MASAYA·Filed 2013·Application pending·0 cites
- 1937US8247338B2High dielectric constant paste composition and dielectric composition using the sameSHIMBA YOICHI·Filed 2009·Granted Aug 21, 2012·0 cites·14 claims
- 2037US2013245160A1Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheetSHIMADA AKIRA·Filed 2011·Application pending·0 cites
- 2136US11444054B2Semiconductor element mounting structure, and combination of semiconductor element and substrateHITACHI CHEMICAL CO LTD·Filed 2018·Granted Sep 13, 2022·0 cites·20 claims
- 2236US2012183775A1Process for production of core-shell particles, core-shell particles, and paste composition and sheet composition which contain sameSHINBA YOICHI·Filed 2010·Application pending·0 cites
- 2336US2015050778A1Method and apparatus for producing semiconductor deviceTORAY INDUSTRIES·Filed 2013·Application pending·0 cites
- 2435US2014291870A1Resin composition, resin composition sheet, semiconductor device and production method thereforTORAY INDUSTRIES·Filed 2012·Application pending·0 cites
- 2533US2006159927A1Paste composition and dielectric composition using the sameHARA YOSHITAKE·Filed 2004·Application pending·0 cites
- 2631US9617451B2Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing sameTORAY INDUSTRIES·Filed 2015·Granted Apr 11, 2017·0 cites·10 claims
- 2727US2012129988A1Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing theseFUJIMARU KOICHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →