Inventor · disambiguated record
Gyanendra Dutt
Also filed as: DUTT GYANENDRA
2 granted patents·4 pending applications·11 citations·filing 2002–2013
51Inventor score
Top patents by PatentIndex Score
6 records- 0181US7608487B2B-stageable underfill encapsulant and method for its applicationHENKEL AG & CO KGAA·Filed 2005·Granted Oct 27, 2009·11 cites·6 claims
- 0245US2013102698A1Dual cure adhesivesHENKEL CORP·Filed 2012·Application pending·0 cites
- 0340US9230888B2Wafer back side coating as dicing tape adhesiveHenkel IP & Holding GmbH·Filed 2013·Granted Jan 5, 2016·0 cites·5 claims
- 0434US2003164555A1B-stageable underfill encapsulant and method for its applicationFiled 2002·Application pending·0 cites
- 0533US2006194064A1Underfill encapsulant for wafer packaging and method for its applicationXIAO ALLISON Y·Filed 2006·Application pending·0 cites
- 0632US2013136858A1Adhesive recycling during spin coatingDUTT GYANENDRA·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Gyanendra Dutt files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →