Inventor · disambiguated record
Shih-Ping Lin
Also filed as: LIN SHIH-PING
12 granted patents·14 pending applications·23 citations·filing 2001–2025
85Inventor score
Files withIND TECH RES INST10HTC CORP5TAIWAN SEMICONDUCTOR MFG CO LTD5AU OPTRONICS CORP2AU OPTRONICS SUZHOU CORP LTD1
Top patents by PatentIndex Score
26 records- 0190US12417991B2Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·1 cites·20 claims
- 0278US11141262B2Bone implantIND TECH RES INST·Filed 2018·Granted Oct 12, 2021·3 cites·16 claims
- 0374US2025323198A1Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0471US6759284B2Method for polysilicon crystallization by simultaneous laser and rapid thermal annealingIND TECH RES INST·Filed 2002·Granted Jul 6, 2004·10 cites·20 claims
- 0567US10122193B2Portable device and method for controlling charging current thereofHTC CORP·Filed 2014·Granted Nov 6, 2018·3 cites·18 claims
- 0666US12433758B2Expandable spinal implantIND TECH RES INST·Filed 2023·Granted Oct 7, 2025·0 cites·17 claims
- 0765US10101982B2Methods for application management in an electronic device supporting hardware accelerationHTC CORP·Filed 2013·Granted Oct 16, 2018·4 cites·17 claims
- 0863US8927992B2Display apparatusAU OPTRONICS SUZHOU CORP LTD·Filed 2013·Granted Jan 6, 2015·1 cites·8 claims
- 0962US10491006B2Hand-held apparatus and method for power charging management thereofHTC CORP·Filed 2017·Granted Nov 26, 2019·1 cites·11 claims
- 1061US2021085606A1Use of hydrogel composition for alleviating degenerative joint and tendon tearIND TECH RES INST·Filed 2020·Application pending·0 cites
- 1155US2019192437A1Powder form and use of hydrogel compositions for alleviating degenerative joint and tendon tearIND TECH RES INST·Filed 2017·Application pending·0 cites
- 1253US11619845B2Display device and method of manufacturing thereofAU OPTRONICS CORP·Filed 2020·Granted Apr 4, 2023·0 cites·19 claims
- 1353US2024047365A1Structure and formation method of package with integrated chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1453US2024079392A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1553US2024206193A1Structure and formation method of package with integrated chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1652US11596450B2Low-profile offset-type spinal fusion deviceIND TECH RES INST·Filed 2021·Granted Mar 7, 2023·0 cites·12 claims
- 1751US2002133451A1Dynamic price changing web marketing system and the method for the sameFiled 2001·Application pending·0 cites
- 1850US11801146B2Artificial intervertebral discIND TECH RES INST·Filed 2021·Granted Oct 31, 2023·0 cites·16 claims
- 1950US2002111871A1Method and system for implementing contract stores on a networkFiled 2001·Application pending·0 cites
- 2046US2022175432A1Bone screwIND TECH RES INST·Filed 2020·Application pending·0 cites
- 2145US2022079639A1Flexible bone fixation deviceIND TECH RES INST·Filed 2020·Application pending·0 cites
- 2241US7961270B2Display device with low scratch visibility and manufacturing method thereofAU OPTRONICS CORP·Filed 2009·Granted Jun 14, 2011·0 cites·20 claims
- 2341US2019201061A1Expandable orthopedic implantIND TECH RES INST·Filed 2017·Application pending·0 cites
- 2437US2017294794A1Electronic system and charging methodHTC CORP·Filed 2017·Application pending·0 cites
- 2537US2018198296A1Hand-held electronic apparatus, charging system, connector and charging management method thereofHTC CORP·Filed 2017·Application pending·0 cites
- 2636US2008133990A1Scan Test Data Compression Method And Decoding Apparatus For Multiple-Scan-Chain DesignsLIN SHIH-PING·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →