Inventor · disambiguated record
Masataka Kawai
Also filed as: KAWAI MASATAKA
4 granted patents·42 citations·filing 1991–2002
72Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0150US5324985APackaged semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jun 28, 1994·23 cites·8 claims
- 0245US5251107ASemiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 5, 1993·17 cites·6 claims
- 0335US6724630B2Stacked device assemblyRENESAS TECH CORP·Filed 2002·Granted Apr 20, 2004·0 cites·5 claims
- 0427US5187565ALiquid sealed semiconductor device and method of assembling the sameMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Feb 16, 1993·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →