Inventor · disambiguated record
Guy Redler
Also filed as: REDLER GUY
14 granted patents·11 pending applications·25 citations·filing 2019–2024
88Inventor score
Files withPROTEANTECS LTD25
Top patents by PatentIndex Score
25 records- 0198US12013800B1Die-to-die and chip-to-chip connectivity monitoringPROTEANTECS LTD·Filed 2023·Granted Jun 18, 2024·8 cites·22 claims
- 0297US11815551B1Die-to-die connectivity monitoring using a clocked receiverPROTEANTECS LTD·Filed 2022·Granted Nov 14, 2023·5 cites·13 claims
- 0394US11293977B2Die-to-die connectivity monitoringPROTEANTECS LTD·Filed 2021·Granted Apr 5, 2022·6 cites·21 claims
- 0486US2024418770A1Integrated circuit workload, temperature, and/or sub-threshold leakage sensorPROTEANTECS LTD·Filed 2024·Application pending·0 cites
- 0585US12072376B2Die-to-die connectivity monitoringPROTEANTECS LTD·Filed 2022·Granted Aug 27, 2024·1 cites·18 claims
- 0683US11408932B2Integrated circuit workload, temperature and/or subthreshold leakage sensorPROTEANTECS LTD·Filed 2019·Granted Aug 9, 2022·2 cites·22 claims
- 0782US12092684B2Integrated circuit workload, temperature, and/or sub-threshold leakage sensorPROTEANTECS LTD·Filed 2023·Granted Sep 17, 2024·0 cites·23 claims
- 0882US10740262B2Integrated circuit I/O integrity and degradation monitoringPROTEANTECS LTD·Filed 2019·Granted Aug 11, 2020·2 cites·21 claims
- 0979US12470223B2Adaptive frequency scaling based on clock cycle time measurementPROTEANTECS LTD·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
- 1078US2024004812A1Integrated circuit pad failure detectionPROTEANTECS LTD·Filed 2023·Application pending·0 cites
- 1177US11619551B1Thermal sensor for integrated circuitPROTEANTECS LTD·Filed 2022·Granted Apr 4, 2023·0 cites·13 claims
- 1276US2024353476A1Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensingPROTEANTECS LTD·Filed 2022·Application pending·0 cites
- 1376US2025130117A1Thermal sensor for integrated circuitPROTEANTECS LTD·Filed 2023·Application pending·0 cites
- 1475US11740281B2Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensingPROTEANTECS LTD·Filed 2022·Granted Aug 29, 2023·0 cites·13 claims
- 1575US2024393390A1Die-to-die connectivity monitoringPROTEANTECS LTD·Filed 2024·Application pending·0 cites
- 1674US11762789B2Integrated circuit I/O integrity and degradation monitoringPROTEANTECS LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1771US12123908B1Loopback testing of integrated circuitsPROTEANTECS LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1869US11275700B2Integrated circuit I/O integrity and degradation monitoringPROTEANTECS LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 1958US2025224447A1Die-to-die and chip-to-chip interconnect clock skew compensationPROTEANTECS LTD·Filed 2024·Application pending·0 cites
- 2058US2024038602A1Die-to-die connectivity monitoring with a clocked receiverPROTEANTECS LTD·Filed 2023·Application pending·0 cites
- 2154US11929131B2Memory device degradation monitoringPROTEANTECS LTD·Filed 2020·Granted Mar 12, 2024·0 cites·22 claims
- 2250US2025112626A1Integrated circuit glitch detectionPROTEANTECS LTD·Filed 2024·Application pending·0 cites
- 2350US2025012852A1Integrated circuit simulator for degradation estimation and time-of-failure predictionPROTEANTECS LTD·Filed 2022·Application pending·0 cites
- 2446US2022268644A1On-die thermal sensing network for integrated circuitsPROTEANTECS LTD·Filed 2020·Application pending·0 cites
- 2542US2022343048A1Determination of unknown bias and device parameters of integrated circuits by measurement and simulationPROTEANTECS LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →