Inventor · disambiguated record
Riichirou Aoki
Also filed as: AOKI RIICHIROU
21 granted patents·1 pending application·1,219 citations·filing 1987–2005
97Inventor score
Top patents by PatentIndex Score
22 records- 0196US5429995AMethod of manufacturing silicon oxide film containing fluorineTOSHIBA KK·Filed 1993·Granted Jul 4, 1995·421 cites·10 claims
- 0292US5885138AMethod and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 1996·Granted Mar 23, 1999·75 cites·124 claims
- 0391US5398459AMethod and apparatus for polishing a workpieceTOSHIBA KK·Filed 1993·Granted Mar 21, 1995·74 cites·15 claims
- 0489US5445996AMethod for planarizing a semiconductor device having a amorphous layerTOSHIBA KK·Filed 1993·Granted Aug 29, 1995·87 cites·1 claims
- 0588US5616063APolishing apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1994·Granted Apr 1, 1997·123 cites·16 claims
- 0687US5597341ASemiconductor planarizing apparatusTOSHIBA KK·Filed 1995·Granted Jan 28, 1997·60 cites·14 claims
- 0785US6439971B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 27, 2002·20 cites·52 claims
- 0885US5571578AMethod for forming silicon oxide on a semiconductorTOHSIBA KK·Filed 1995·Granted Nov 5, 1996·64 cites·12 claims
- 0981US6443808B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Sep 3, 2002·14 cites·64 claims
- 1081US6425806B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Jul 30, 2002·14 cites·112 claims
- 1181US5914275APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Jun 22, 1999·43 cites·24 claims
- 1281US5653623APolishing apparatus with improved exhaustEBARA CORP·Filed 1994·Granted Aug 5, 1997·38 cites·9 claims
- 1379US6547638B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 2001·Granted Apr 15, 2003·12 cites·41 claims
- 1479US5948205APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Sep 7, 1999·41 cites·17 claims
- 1579US5695601AMethod for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the methodTOSHIBA KK·Filed 1995·Granted Dec 9, 1997·60 cites·10 claims
- 1661US6273802B1Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 1999·Granted Aug 14, 2001·14 cites·35 claims
- 1759US4937652ASemiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 1988·Granted Jun 26, 1990·25 cites·16 claims
- 1858US5641581ASemiconductor deviceTOSHIBA KK·Filed 1995·Granted Jun 24, 1997·20 cites·4 claims
- 1955US6966821B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 2003·Granted Nov 22, 2005·2 cites·6 claims
- 2051US2006009130A1Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceOKUMURA KATSUYA·Filed 2005·Application pending·0 cites
- 2140US4875088ASemiconductor device having a backplate electrodeTOSHIBA KK·Filed 1987·Granted Oct 17, 1989·8 cites·28 claims
- 2233US5068709ASemiconductor device having a backplate electrodeTOSHIBA KK·Filed 1989·Granted Nov 26, 1991·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →