Inventor · disambiguated record
Seigo Kurosaka
Also filed as: KUROSAKA SEIGO
4 granted patents·1 pending application·11 citations·filing 2006–2020
64Inventor score
Top patents by PatentIndex Score
5 records- 0171US7678183B2Electroless palladium plating bath and electroless palladium plating methodUYEMURA C & CO LTD·Filed 2006·Granted Mar 16, 2010·9 cites·11 claims
- 0264US8124174B2Electroless gold plating method and electronic partsKUROSAKA SEIGO·Filed 2008·Granted Feb 28, 2012·2 cites·6 claims
- 0354US7985285B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Jul 26, 2011·0 cites·11 claims
- 0452US2020205298A1Heat-resistant power module substrate, heat-resistant plating film and plating solutionUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 0547US10763204B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Sep 1, 2020·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →