Inventor · disambiguated record
Navneet Singh
Also filed as: SINGH I NAVNEET KUMAR · SINGH NAVNEET · SINGH NAVNEET K · SINGH NAVNEET KUMAR
17 granted patents·19 pending applications·88 citations·filing 2001–2024
90Inventor score
Files withINTEL CORP29APPLIED MATERIALS INC1BELWADI S SRIKANTH1BHAT PRAVEEN KASHYAP ANANTA1GOOGLE INC1
Top patents by PatentIndex Score
36 records- 0191US11966268B2Apparatus and methods for thermal management of electronic user devices based on user activityINTEL CORP·Filed 2022·Granted Apr 23, 2024·3 cites·20 claims
- 0291US11360528B2Apparatus and methods for thermal management of electronic user devices based on user activityINTEL CORP·Filed 2019·Granted Jun 14, 2022·19 cites·38 claims
- 0380US7516084B1Approach for managing forecast dataLAWSON SOFTWARE INC·Filed 2001·Granted Apr 7, 2009·48 cites·11 claims
- 0477US10177161B2Methods of forming package structures for enhanced memory capacity and structures formed therebyINTEL CORP·Filed 2016·Granted Jan 8, 2019·3 cites·17 claims
- 0575US8521581B2Interactive text message advertisementsBELWADI S SRIKANTH·Filed 2008·Granted Aug 27, 2013·7 cites·23 claims
- 0671US9152474B2Context aware synchronization using context and input parameter objects associated with a mutual exclusion lockNETAPP INC·Filed 2014·Granted Oct 6, 2015·4 cites·20 claims
- 0763USD980842SShielding for circuit boardINTEL CORP·Filed 2020·Granted Mar 14, 2023·4 cites·1 claims
- 0862US12382575B2Solderless or groundless electromagnetic shielding in electronic devicesINTEL CORP·Filed 2021·Granted Aug 5, 2025·0 cites·25 claims
- 0962US10656177B2Probe connector for a probing pad structure around a thermal attach mounting holeINTEL CORP·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 1061US12334232B2External cooling solution for mobile computing devicesINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·22 claims
- 1159US2025123749A1Detection of memory accessesINTEL CORP·Filed 2024·Application pending·0 cites
- 1257US2025021228A1Locking hardware for a shared memorySINGH NAVNEET·Filed 2024·Application pending·0 cites
- 1355US2024175640A1Variable dimension heat pipeINTEL CORP·Filed 2023·Application pending·0 cites
- 1454US10317428B2Probe connector for a probing pad structure around a thermal attach mounting holeINTEL CORP·Filed 2016·Granted Jun 11, 2019·0 cites·20 claims
- 1553US12300918B2Memory module connector for thin computing systemsINTEL CORP·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 1653US2023299516A1Double-sided ultra slim module connectorINTEL CORP·Filed 2023·Application pending·0 cites
- 1753US2009089169A1Event Based ServingGOOGLE INC·Filed 2008·Application pending·0 cites
- 1852US12025971B2Socket interposer for system-in-package (SIP) module qualification in product platform validation (PPV) setupINTEL CORP·Filed 2022·Granted Jul 2, 2024·0 cites·19 claims
- 1952US2024164063A1Axially arranged communication and thermal interconnects for foldable electronic devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 2051US10734393B2Methods of forming package structures for enhanced memory capacity and structures formed therebyINTEL CORP·Filed 2018·Granted Aug 4, 2020·0 cites·9 claims
- 2151US10720407B2Microelectronic interposer for a microelectronic packageINTEL CORP·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 2251US2024063203A1Package architectures with glass cores for thickness reduction and 3d integrationINTEL CORP·Filed 2022·Application pending·0 cites
- 2350US2024405459A1Modular Printed Circuit Boards with ConnectorsINTEL CORP·Filed 2023·Application pending·0 cites
- 2449US2024334715A1For memory on package with reduced thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 2548US2025008282A1Methods and apparatus to improve audio quality based on load impedance sensingINTEL CORP·Filed 2023·Application pending·0 cites
- 2648US2022404862A1Separable electronics device using a modular connection deviceINTEL CORP·Filed 2022·Application pending·0 cites
- 2747US11538731B2Thermal solutions for package on package (PoP) architecturesINTEL CORP·Filed 2019·Granted Dec 27, 2022·0 cites·24 claims
- 2847US2023269867A1Pcb mlcc-induced acoustic noise reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 2947US2025113430A1Technologies for reducing the impact of radiofrequency interference on a circuit boardINTEL CORP·Filed 2023·Application pending·0 cites
- 3046US10199353B2Microelectronic interposer for a microelectronic packageINTEL CORP·Filed 2016·Granted Feb 5, 2019·0 cites·29 claims
- 3146US2024006873A1Technology to resolve connector damage due to arcingINTEL CORP·Filed 2022·Application pending·0 cites
- 3245US2022316692A1Cooling systems and apparatus for electronic devices and related methodsBHAT PRAVEEN KASHYAP ANANTA·Filed 2022·Application pending·0 cites
- 3345US2025117915A1Optical inspection-based automatic defect classificationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3441US2022200127A1Integrated Antenna Control Mechanism on LID with Lid Controller HubINTEL CORP·Filed 2021·Application pending·0 cites
- 3537US2022335910A1Apparatus, systems, and related methods for display panel power savings during stylus usageINTEL CORP·Filed 2022·Application pending·0 cites
- 3637US2019206839A1Electronic device packageINTEL CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →