Inventor · disambiguated record
Yasutaka Tsuboi
Also filed as: TSUBOI YASUTAKA
15 granted patents·1 pending application·145 citations·filing 1996–2015
92Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD9PANASONIC CORP3PANASONIC IP MAN CO LTD2TSUBOI YASUTAKA2
Top patents by PatentIndex Score
16 records- 0186US6542238B1Electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 1, 2003·65 cites·20 claims
- 0277US7014092B2Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 21, 2006·16 cites·9 claims
- 0373US9036022B2Component mounting apparatus, illuminating apparatus used in imaging and illuminating methodTSUBOI YASUTAKA·Filed 2011·Granted May 19, 2015·6 cites·6 claims
- 0472US9739300B2Component crimping apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 22, 2017·2 cites·3 claims
- 0571US10058019B2Bonding apparatusPANASONIC CORP·Filed 2014·Granted Aug 21, 2018·2 cites·3 claims
- 0669US7516878B2Bump formation method and bump forming apparatus for semiconductor waferPANASONIC CORP·Filed 2005·Granted Apr 14, 2009·2 cites·6 claims
- 0769US7021357B2Component mounting apparatus and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 4, 2006·13 cites·8 claims
- 0859US7052984B2Bump formation method and bump forming apparatus for semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 30, 2006·6 cites·24 claims
- 0954US7005368B1Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 28, 2006·3 cites·8 claims
- 1053US5825914AComponent detection methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 20, 1998·20 cites·3 claims
- 1151US9703129B2Component mounting apparatusPANASONIC CORP·Filed 2014·Granted Jul 11, 2017·0 cites·9 claims
- 1247US7031509B2Method and apparatus for correcting inclination of IC on semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 18, 2006·2 cites·15 claims
- 1340US6818975B1Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 16, 2004·0 cites·29 claims
- 1438US5872863AComponent detection methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Feb 16, 1999·8 cites·1 claims
- 1537US9872395B2Component crimping apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 16, 2018·0 cites·1 claims
- 1634US2012262567A1Component mounting apparatus, illuminating apparatus used in imaging and illuminating methodTSUBOI YASUTAKA·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yasutaka Tsuboi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →