Inventor · disambiguated record
Min Hyang Kim
Also filed as: KIM MIN HYANG
12 granted patents·1 pending application·12 citations·filing 2015–2023
84Inventor score
Files withSAMSUNG ELECTRO MECH13
Top patents by PatentIndex Score
13 records- 0187US11437193B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 6, 2022·2 cites·16 claims
- 0287US10529491B1Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 7, 2020·5 cites·6 claims
- 0383US11848158B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 19, 2023·1 cites·22 claims
- 0481US9997294B2Electronic component and circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·2 cites·14 claims
- 0579US11721486B2Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrodeSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 8, 2023·1 cites·20 claims
- 0674US12198863B2Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrodeSAMSUNG ELECTRO MECH·Filed 2023·Granted Jan 14, 2025·0 cites·16 claims
- 0770US11705279B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 18, 2023·0 cites·12 claims
- 0864US11257621B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 22, 2022·0 cites·19 claims
- 0964US9633785B2Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Apr 25, 2017·1 cites·16 claims
- 1063US10923285B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 16, 2021·0 cites·4 claims
- 1162US11728097B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 15, 2023·0 cites·14 claims
- 1253US2024222031A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1335US9646768B2Chip componentSAMSUNG ELECTRO MECH·Filed 2015·Granted May 9, 2017·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →