Inventor · disambiguated record
Enboa Wu
Also filed as: WU ENBOA
14 granted patents·6 pending applications·476 citations·filing 2000–2012
93Inventor score
Files withUNIV NAT TAIWAN6IND TECH RES INST5HK APPLIED SCIENCE & TECH RES4HO WING YAN1SHUY GEOFFREY WEN-TAI1
Top patents by PatentIndex Score
20 records- 0197US7511365B2Thermal enhanced low profile package structureIND TECH RES INST·Filed 2005·Granted Mar 31, 2009·74 cites·14 claims
- 0296US7754530B2Thermal enhanced low profile package structure and method for fabricating the sameIND TECH RES INST·Filed 2009·Granted Jul 13, 2010·41 cites·9 claims
- 0394US7203426B2Optical subassembly of optical transceiverUNIV NAT TAIWAN·Filed 2005·Granted Apr 10, 2007·50 cites·27 claims
- 0494US6459150B1Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layerIND TECH RES INST·Filed 2000·Granted Oct 1, 2002·125 cites·9 claims
- 0593US6433427B1Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabricationIND TECH RES INST·Filed 2001·Granted Aug 13, 2002·110 cites·20 claims
- 0692US7943052B2Method for self-assembling microstructuresUNIV NAT TAIWAN·Filed 2007·Granted May 17, 2011·22 cites·28 claims
- 0784US7482632B2LED assembly and use thereofHK APPLIED SCIENCE & TECH RES·Filed 2006·Granted Jan 27, 2009·28 cites·25 claims
- 0883US8672512B2Omni reflective optics for wide angle emission LED light bulbZHOU LI·Filed 2012·Granted Mar 18, 2014·6 cites·20 claims
- 0968US7351609B2Method for wafer level package of sensor chipUNIV NAT TAIWAN·Filed 2006·Granted Apr 1, 2008·5 cites·38 claims
- 1067US8013347B2Remote control lighting assembly and use thereofHK APPLIED SCIENCE & TECH RES·Filed 2007·Granted Sep 6, 2011·8 cites·36 claims
- 1163US7271020B2Light emitting diode covered with a reflective layer and method for fabricating the sameUNIV NAT TAIWAN·Filed 2005·Granted Sep 18, 2007·2 cites·12 claims
- 1256US7013066B1Tunable long period fiber grating structure and fabrication methodUNIV NAT TAIWAN·Filed 2005·Granted Mar 14, 2006·3 cites·29 claims
- 1354US8558254B1High reliability high voltage vertical LED arraysHO WING YAN·Filed 2012·Granted Oct 15, 2013·2 cites·20 claims
- 1445US2007007237A1Method for self-assembling microstructuresUNIV NAT TAIWAN·Filed 2005·Application pending·0 cites
- 1544US2007145884A1Light emitting diode die with at least one phosphor layer and method for forming the sameHK APPLIED SCIENCE & TECH RES·Filed 2006·Application pending·0 cites
- 1641US2006088255A1Multi-wavelength optical transceiver subassembly moduleWU ENBOA·Filed 2004·Application pending·0 cites
- 1741US2006108146A1Structure of electronic package and method for fabricating the sameIND TECH RES INST·Filed 2005·Application pending·0 cites
- 1840US2008099772A1Light emitting diode matrixSHUY GEOFFREY WEN-TAI·Filed 2006·Application pending·0 cites
- 1936US7474287B2Light emitting deviceHK APPLIED SCIENCE & TECH RES·Filed 2005·Granted Jan 6, 2009·0 cites·16 claims
- 2027US2008001277A1Semiconductor package system and method of improving heat dissipation of a semiconductor packageWEN TSRONG YI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →