Inventor · disambiguated record
Chaur-Chin Yang
Also filed as: YANG CHAUR-CHIN
5 granted patents·3 pending applications·334 citations·filing 2002–2005
85Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG7
Top patents by PatentIndex Score
8 records- 0194US6768190B2Stack type flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jul 27, 2004·141 cites·3 claims
- 0291US6861761B2Multi-chip stack flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·74 cites·17 claims
- 0390US7034388B2Stack type flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 25, 2006·73 cites·20 claims
- 0483US6717253B2Assembly package with stacked dies and signal transmission plateADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·37 cites·12 claims
- 0558US7473989B2Flip-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2009·9 cites·14 claims
- 0638US2005287705A1Flip chip on leadframe package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 0737US2004145035A1Signal transmission plate used in an assembly packageFiled 2004·Application pending·0 cites
- 0836US2004173903A1Thin type ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →