Inventor · disambiguated record
Klaus Schuegraf
Also filed as: SCHUEGRAF KLAUS · SCHUEGRAF KLAUS F · SCHUEGRAF KLAUS FLORIAN
102 granted patents·6 pending applications·2,457 citations·filing 1991–2024
99Inventor score
Files withMICRON TECHNOLOGY INC52NEWPORT FAB LLC29APPLIED MATERIALS INC3SEKAR DEEPAK C3KUEHNLE MANFRED R2
Top patents by PatentIndex Score
108 records- 0199US5801104AUniform dielectric film deposition on textured surfacesMICRON TECHNOLOGY INC·Filed 1995·Granted Sep 1, 1998·546 cites·18 claims
- 0297US7808831B2Read disturb mitigation in non-volatile memorySANDISK CORP·Filed 2008·Granted Oct 5, 2010·54 cites·26 claims
- 0396US6974780B2Semiconductor processing methods of chemical vapor depositing SiO2 on a substrateMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 13, 2005·88 cites·7 claims
- 0495US12170248B2Graphene BEOL integration interconnection structuresDESTINATION 2D INC·Filed 2024·Granted Dec 17, 2024·5 cites·20 claims
- 0595US7876620B2Read disturb mitigation in non-volatile memorySANDISK CORP·Filed 2010·Granted Jan 25, 2011·21 cites·20 claims
- 0693US6586297B1Method for integrating a metastable base into a high-performance HBT and related structureNEWPORT FAB LLC·Filed 2002·Granted Jul 1, 2003·71 cites·13 claims
- 0792US8709953B2Pulsed plasma with low wafer temperature for ultra thin layer etchesAPPLIED MATERIALS INC·Filed 2012·Granted Apr 29, 2014·12 cites·10 claims
- 0891US6444591B1Method for reducing contamination prior to epitaxial growth and related structureNEWPORT FAB LLC·Filed 2000·Granted Sep 3, 2002·49 cites·16 claims
- 0990US5702976AShallow trench isolation using low dielectric constant insulatorMICRON TECHNOLOGY INC·Filed 1995·Granted Dec 30, 1997·88 cites·22 claims
- 1089US6015986ARugged metal electrodes for metal-insulator-metal capacitorsMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 18, 2000·71 cites·16 claims
- 1188US5679412AMethod and apparatus for producing gas impermeable, chemically inert container structures for food and volatile substancesKUEHNLE MANFRED R·Filed 1996·Granted Oct 21, 1997·83 cites·20 claims
- 1287US8154904B2Programming reversible resistance switching elementsSEKAR DEEPAK C·Filed 2009·Granted Apr 10, 2012·15 cites·14 claims
- 1387US5786248ASemiconductor processing method of forming a tantalum oxide containing capacitorMICRON TECHNOLOGY INC·Filed 1995·Granted Jul 28, 1998·61 cites·28 claims
- 1486US5639685ASemiconductor processing method of providing a conductively doped layer of hemispherical grain polysiliconMICRON TECHNOLOGY INC·Filed 1995·Granted Jun 17, 1997·71 cites·24 claims
- 1586US5624865AHigh pressure reoxidation anneal of silicon nitride for reduced thermal budget silicon processingMICRON TECHNOLOGY INC·Filed 1995·Granted Apr 29, 1997·66 cites·26 claims
- 1685US6459562B1High density metal insulator metal capacitorsCONEXANT SYSTEMS INC·Filed 2001·Granted Oct 1, 2002·52 cites·32 claims
- 1785US6046093AMethod of forming capacitors and related integrated circuitryMICRON TECHNOLOLGY INC·Filed 1997·Granted Apr 4, 2000·57 cites·35 claims
- 1885US5930106ADRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric filmsMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 27, 1999·51 cites·22 claims
- 1984US6534802B1Method for reducing base to collector capacitance and related structureNEWPORT FAB LLC·Filed 2001·Granted Mar 18, 2003·33 cites·22 claims
- 2083US5886392AOne-time programmable element having controlled programmed state resistanceMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 23, 1999·47 cites·13 claims
- 2183US5211995AMethod of protecting an organic surface by deposition of an inorganic refractory coating thereonKUEHNLE MANFRED R·Filed 1991·Granted May 18, 1993·51 cites·22 claims
- 2282US6141204ACapacitor constructions and semiconductor processing method of forming capacitor constructionsMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 31, 2000·44 cites·15 claims
- 2381US10679723B1Direct memory characterization using periphery transistorsPDF SOLUTIONS INC·Filed 2018·Granted Jun 9, 2020·4 cites·20 claims
- 2481US6150208ADRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric filmsMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·40 cites·19 claims
- 2580US6368887B1Method of monitoring a process of manufacturing a semiconductor wafer including hemispherical grain polysiliconMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 9, 2002·17 cites·22 claims
- 2680US6071771ASemiconductor processing method of forming a capacitor and capacitor constructionsMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 6, 2000·38 cites·23 claims
- 2780US5849624AMethod of fabricating a bottom electrode with rounded corners for an integrated memory cell capacitorMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 15, 1998·48 cites·9 claims
- 2879US6459104B1Method for fabricating lateral PNP heterojunction bipolar transistor and related structureNEWPORT FAB·Filed 2001·Granted Oct 1, 2002·27 cites·30 claims
- 2979US6008086AMethod of deposting uniform dielectric film deposition on textured surfacesMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 28, 1999·46 cites·19 claims
- 3079US5985732AMethod of forming integrated stacked capacitors with rounded cornersMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 16, 1999·46 cites·11 claims
- 3178US8994089B2Interlayer polysilicon dielectric cap and method of forming thereofROGERS MATTHEW S·Filed 2011·Granted Mar 31, 2015·4 cites·15 claims
- 3277US6611032B2Methods for forming wordlines, transistor gates, and conductive interconnects, and wordline, transistor gate, and conductive interconnect structuresMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·17 cites·16 claims
- 3375US6015743ASemiconductor processing method of providing a conductively doped layer of hemispherical grain polysilicon and a hemispherical grain polysilicon layer produced according to the methodFiled 1998·Granted Jan 18, 2000·36 cites·14 claims
- 3474US8288293B2Integrated circuit fabrication using sidewall nitridation processesPHAM TUAN·Filed 2010·Granted Oct 16, 2012·4 cites·18 claims
- 3574US6746928B1Method for opening a semiconductor region for fabricating an HBTNEWPORT FAB LLC·Filed 2001·Granted Jun 8, 2004·18 cites·30 claims
- 3674US6680235B1Method for fabricating a selective eptaxial HBT emitterNEWPORT FAB LLC·Filed 2002·Granted Jan 20, 2004·16 cites·11 claims
- 3773US6620732B1Method for controlling critical dimension in a polycrystalline silicon emitter and related structureNEWPORT FAB LLC·Filed 2000·Granted Sep 16, 2003·15 cites·19 claims
- 3873US6586307B1Method for controlling an emitter window opening in an HBT and related structureNEWPORT FAB LLC·Filed 2002·Granted Jul 1, 2003·14 cites·10 claims
- 3971US6908803B2Methods for forming wordlines, transistor gates, and conductive interconnects, and wordline, transistor gate, and conductive interconnect structuresMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 21, 2005·12 cites·24 claims
- 4071US6830967B1Method for forming CMOS transistor spacers in a BiCMOS processNEWPORT FAB LLC·Filed 2002·Granted Dec 14, 2004·14 cites·24 claims
- 4171US6781214B1Metastable base in a high-performance HBTNEWPORT FAB LLC·Filed 2002·Granted Aug 24, 2004·14 cites·10 claims
- 4269US6730584B2Methods for forming wordlines, transistor gates, and conductive interconnects, and wordline, transistor gate, and conductive interconnect structuresMICRON TECHNOLOGY INC·Filed 1999·Granted May 4, 2004·21 cites·29 claims
- 4369US5891744AMethod of monitoring a process of manufacturing a semiconductor wafer including hemispherical grain polysiliconMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 6, 1999·26 cites·3 claims
- 4468US8498146B2Programming reversible resistance switching elementsSEKAR DEEPAK C·Filed 2012·Granted Jul 30, 2013·3 cites·20 claims
- 4568US6992338B1CMOS transistor spacers formed in a BiCMOS processNEWPORT FAB LLC·Filed 2004·Granted Jan 31, 2006·11 cites·12 claims
- 4667US6638819B1Method for fabricating interfacial oxide in a transistor and related structureNEWPORT FAB LLC·Filed 2000·Granted Oct 28, 2003·11 cites·29 claims
- 4767US6222222B1Methods of forming capacitors and related integrated circuitryMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 24, 2001·21 cites·7 claims
- 4867US5920763AMethod and apparatus for improving the structural integrity of stacked capacitorsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 6, 1999·23 cites·17 claims
- 4966US5849644ASemiconductor processing methods of chemical vapor depositing SiO2 on a substrateMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 15, 1998·31 cites·22 claims
- 5066US5830793AMethod of selective texfturing for patterned polysilicon electrodesMICRON TECHNOLOGY INC·Filed 1995·Granted Nov 3, 1998·24 cites·17 claims
Showing the top 50 of 108 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →