Inventor · disambiguated record
Yi-Liang Peng
Also filed as: PENG YI · PENG YI-LIANG
6 granted patents·3 pending applications·240 citations·filing 1999–2023
85Inventor score
Files withALIBABA GROUP HOLDING LTD2FIRST INT COMPUTER INC2VATE TECHNOLOGY CO LTD2ALIPAY HANGZHOU INF TECH CO LTD1
Top patents by PatentIndex Score
9 records- 0190US6215180B1Dual-sided heat dissipating structure for integrated circuit packageFIRST INT COMPUTER INC·Filed 1999·Granted Apr 10, 2001·141 cites·6 claims
- 0275US6130477AThin enhanced TAB BGA package having improved heat dissipationFiled 1999·Granted Oct 10, 2000·55 cites·20 claims
- 0369US6633086B1Stacked chip scale package structureVATE TECHNOLOGY CO LTD·Filed 2002·Granted Oct 14, 2003·18 cites·1 claims
- 0467US9390103B2Information searching method and system based on geographic locationALIBABA GROUP HOLDING LTD·Filed 2013·Granted Jul 12, 2016·3 cites·14 claims
- 0561US6570263B1Structure of plated wire of fiducial marks for die-dicing packageVATE TECHNOLOGY CO LTD·Filed 2002·Granted May 27, 2003·12 cites·2 claims
- 0646US2023334095A1Storage method for graph data and distributed computing method for graph dataALIPAY HANGZHOU INF TECH CO LTD·Filed 2023·Application pending·0 cites
- 0743US2016357766A1Information searching method and system based on geographic locationALIBABA GROUP HOLDING LTD·Filed 2016·Application pending·0 cites
- 0842US6160311AEnhanced heat dissipating chip scale package method and devicesFIRST INT COMPUTER INC·Filed 1999·Granted Dec 12, 2000·11 cites·7 claims
- 0933US2004009628A1Fabrication method of substrate on chip CA ball grid array packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →