Inventor · disambiguated record
Kevin Matthew Durocher
Also filed as: DUROCHER KEVIN · DUROCHER KEVIN M · DUROCHER KEVIN MATTHEW
64 granted patents·9 pending applications·2,552 citations·filing 1993–2018
99Inventor score
Top patents by PatentIndex Score
73 records- 0199US6614103B1Plastic packaging of LED arraysGEN ELECTRIC·Filed 2000·Granted Sep 2, 2003·331 cites·26 claims
- 0299US5874770AFlexible interconnect film including resistor and capacitor layersGEN ELECTRIC·Filed 1996·Granted Feb 23, 1999·489 cites·16 claims
- 0398US6733711B2Plastic packaging of LED arraysGEN ELECTRIC·Filed 2003·Granted May 11, 2004·208 cites·20 claims
- 0497US5472539AMethods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated componentsGEN ELECTRIC·Filed 1994·Granted Dec 5, 1995·137 cites·10 claims
- 0596US8008125B2System and method for stacked die embedded chip build-upGEN ELECTRIC·Filed 2009·Granted Aug 30, 2011·61 cites·24 claims
- 0695US5531018AMethod of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced therebyGEN ELECTRIC·Filed 1993·Granted Jul 2, 1996·97 cites·11 claims
- 0793US8824635B2Detector modules for imaging systems and methods of manufacturingTKACZYK JOHN ERIC·Filed 2011·Granted Sep 2, 2014·16 cites·20 claims
- 0893US5736448AFabrication method for thin film capacitorsGEN ELECTRIC·Filed 1995·Granted Apr 7, 1998·142 cites·7 claims
- 0992US8742646B2Ultrasound acoustic assemblies and methods of manufactureWODNICKI ROBERT GIDEON·Filed 2012·Granted Jun 3, 2014·16 cites·6 claims
- 1092US5524339AMethod for protecting gallium arsenide mmic air bridge structuresMARTIN MARIETTA CORP·Filed 1994·Granted Jun 11, 1996·141 cites·11 claims
- 1190US8369671B2Hermetically sealed fiber sensing cableGEN ELECTRIC·Filed 2010·Granted Feb 5, 2013·9 cites·22 claims
- 1290US5657537AMethod for fabricating a stack of two dimensional circuit modulesGEN ELECTRIC·Filed 1995·Granted Aug 19, 1997·102 cites·6 claims
- 1389US6475877B1Method for aligning die to interconnect metal on flex substrateGEN ELECTRIC·Filed 1999·Granted Nov 5, 2002·84 cites·11 claims
- 1488US8049338B2Power semiconductor module and fabrication methodGEN ELECTRIC·Filed 2006·Granted Nov 1, 2011·14 cites·22 claims
- 1588US6709944B1Techniques for fabricating a resistor on a flexible base materialGEN ELECTRIC·Filed 2002·Granted Mar 23, 2004·36 cites·28 claims
- 1687US7952196B1Affordable high performance high frequency multichip module fabrication and apparatusLOCKHEED CORP·Filed 2008·Granted May 31, 2011·14 cites·13 claims
- 1787US7781238B2Methods of making and using integrated and testable sensor arrayWODNICKI ROBERT GIDEON·Filed 2007·Granted Aug 24, 2010·12 cites·22 claims
- 1887US6730533B2Plastic packaging of LED arraysGEN ELECTRIC·Filed 2003·Granted May 4, 2004·35 cites·24 claims
- 1985US10499509B1Methods and systems for a flexible circuitGEN ELECTRIC·Filed 2018·Granted Dec 3, 2019·4 cites·4 claims
- 2085US8466007B2Power semiconductor module and fabrication methodDELGADO ELADIO CLEMENTE·Filed 2011·Granted Jun 18, 2013·7 cites·4 claims
- 2185US8114708B2System and method for pre-patterned embedded chip build-upMCCONNELEE PAUL·Filed 2008·Granted Feb 14, 2012·24 cites·15 claims
- 2284US6767764B2Microelectromechanical system device packaging methodGEN ELECTRIC·Filed 2002·Granted Jul 27, 2004·32 cites·8 claims
- 2383US8653670B2Electrical interconnect for an integrated circuit package and method of making sameMCCONNELEE PAUL ALAN·Filed 2010·Granted Feb 18, 2014·5 cites·21 claims
- 2483US8405996B2Article including thermal interface element and method of preparationSHADDOCK DAVID MULFORD·Filed 2010·Granted Mar 26, 2013·10 cites·23 claims
- 2583US8265228B2Anti-scatter X-ray grid device and method of making sameSHAW JEFFREY JON·Filed 2010·Granted Sep 11, 2012·8 cites·18 claims
- 2683US6323096B1Method for fabricating a flexible interconnect film with resistor and capacitor layersGEN ELECTRIC·Filed 1998·Granted Nov 27, 2001·58 cites·30 claims
- 2783US5652559AMethod of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced therebyGEN ELECTRIC·Filed 1996·Granted Jul 29, 1997·33 cites·6 claims
- 2882US7427566B2Method of making an electronic device cooling systemGEN ELECTRIC·Filed 2005·Granted Sep 23, 2008·12 cites·24 claims
- 2982US6150719AAmorphous hydrogenated carbon hermetic structure and fabrication methodGEN ELECTRIC·Filed 1997·Granted Nov 21, 2000·57 cites·12 claims
- 3082US5699234AStacking of three dimensional high density interconnect modules with metal edge contactsGEN ELECTRIC·Filed 1997·Granted Dec 16, 1997·57 cites·4 claims
- 3181US7791252B2Ultrasound probe assembly and method of fabricationGEN ELECTRIC·Filed 2007·Granted Sep 7, 2010·17 cites·16 claims
- 3280US8008781B2Apparatus and method for reducing pitch in an integrated circuitGEN ELECTRIC·Filed 2008·Granted Aug 30, 2011·9 cites·20 claims
- 3380US7727808B2Ultra thin die electronic packageGEN ELECTRIC·Filed 2008·Granted Jun 1, 2010·6 cites·12 claims
- 3480US5774326AMultilayer capacitors using amorphous hydrogenated carbonGEN ELECTRIC·Filed 1995·Granted Jun 30, 1998·58 cites·9 claims
- 3577US6602739B1Method for making multichip module substrates by encapsulating electrical conductors and filling gapsLOCKHEED CORP·Filed 2002·Granted Aug 5, 2003·25 cites·6 claims
- 3676US5973908AStructure for thin film capacitorsGEN ELECTRIC·Filed 1997·Granted Oct 26, 1999·42 cites·5 claims
- 3775US8623699B2Method of chip package build-upMCCONNELEE PAUL ALAN·Filed 2010·Granted Jan 7, 2014·4 cites·14 claims
- 3875US8498131B2Interconnect structureFILLION RAYMOND ALBERT·Filed 2011·Granted Jul 30, 2013·3 cites·10 claims
- 3975US8331536B2Apparatus for reducing scattered X-ray detection and method of sameSHAW JEFFREY JON·Filed 2009·Granted Dec 11, 2012·15 cites·16 claims
- 4074US9299647B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2014·Granted Mar 29, 2016·2 cites·30 claims
- 4174US6303193B1Process for fabricating a tool used in electrochemical machiningGEN ELECTRIC·Filed 1998·Granted Oct 16, 2001·30 cites·19 claims
- 4272US6773962B2Microelectromechanical system device packaging methodGEN ELECTRIC·Filed 2001·Granted Aug 10, 2004·15 cites·7 claims
- 4371US6994897B2Method of processing high-resolution flex circuits with low distortionGEN ELECTRIC·Filed 2002·Granted Feb 7, 2006·16 cites·12 claims
- 4470US7919714B2System and a method for controlling flow of solderGEN ELECTRIC·Filed 2007·Granted Apr 5, 2011·2 cites·12 claims
- 4569US7964974B2Electronic chip package with reduced contact pad pitchGEN ELECTRIC·Filed 2008·Granted Jun 21, 2011·4 cites·20 claims
- 4667US6933813B2Interconnection structure with etch stopGEN ELECTRIC·Filed 2003·Granted Aug 23, 2005·11 cites·4 claims
- 4766US7517785B2Electronic interconnects and methods of making sameGEN ELECTRIC·Filed 2005·Granted Apr 14, 2009·2 cites·13 claims
- 4862US9570376B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2015·Granted Feb 14, 2017·1 cites·20 claims
- 4961US7952187B2System and method of forming a wafer scale packageGEN ELECTRIC·Filed 2008·Granted May 31, 2011·2 cites·23 claims
- 5059US6671948B2Interconnection method using an etch stopGEN ELECTRIC·Filed 2000·Granted Jan 6, 2004·7 cites·13 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →