Inventor · disambiguated record
Liang Chee Tay
Also filed as: TAY LIANG C · TAY LIANG CHEE
8 granted patents·1 pending application·271 citations·filing 1999–2014
88Inventor score
Top patents by PatentIndex Score
9 records- 0191US6652799B2Method for molding semiconductor componentsMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 25, 2003·97 cites·21 claims
- 0290US6439869B1Apparatus for molding semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 27, 2002·82 cites·32 claims
- 0385US7741150B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 22, 2010·12 cites·20 claims
- 0468US6331737B1Method of encapsulating thin semiconductor chip-scale packagesTEXAS INSTRUMENTS INC·Filed 1999·Granted Dec 18, 2001·42 cites·17 claims
- 0565US6544816B1Method of encapsulating thin semiconductor chip-scale packagesTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 8, 2003·37 cites·16 claims
- 0664US8900923B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 2, 2014·1 cites·8 claims
- 0755US9324676B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 26, 2016·0 cites·12 claims
- 0843US2008172869A1Methods and systems for processing semiconductor workpiecesMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 0941US8399971B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesLEOW SEE HIONG·Filed 2010·Granted Mar 19, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →