Inventor · disambiguated record
Subramanian S. Iyer
Also filed as: IYER SUBRAMANIAN · IYER SUBRAMANIAN S · IYER SUBRAMANIAN SRIKANTESWARA
118 granted patents·14 pending applications·4,089 citations·filing 1985–2025
99Inventor score
Top patents by PatentIndex Score
132 records- 0199US8158515B2Method of making 3D integrated circuitsFAROOQ MUKTA G·Filed 2010·Granted Apr 17, 2012·281 cites·14 claims
- 0299US8129256B23D integrated circuit device fabrication with precisely controllable substrate removalFAROOQ MUKTA G·Filed 2008·Granted Mar 6, 2012·254 cites·18 claims
- 0398US7696000B2Low defect Si:C layer with retrograde carbon profileIBM·Filed 2006·Granted Apr 13, 2010·124 cites·16 claims
- 0497US9466538B1Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding processGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·43 cites·17 claims
- 0597US7411818B1Programmable fuse/non-volatile memory structures using externally heated phase change materialIBM·Filed 2007·Granted Aug 12, 2008·50 cites·5 claims
- 0697US7276751B2Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating sameIBM·Filed 2005·Granted Oct 2, 2007·50 cites·19 claims
- 0796US7724707B2Network for a cellular communication system and a method of operation thereforMOTOROLA INC·Filed 2007·Granted May 25, 2010·83 cites·19 claims
- 0896US6624499B2System for programming fuse structure by electromigration of silicide enhanced by creating temperature gradientINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 23, 2003·158 cites·12 claims
- 0996US5759898AProduction of substrate for tensilely strained semiconductorIBM·Filed 1996·Granted Jun 2, 1998·321 cites·16 claims
- 1096US5461243ASubstrate for tensilely strained semiconductorIBM·Filed 1993·Granted Oct 24, 1995·387 cites·6 claims
- 1195US9859262B1Thermally enhanced package to reduce thermal interaction between diesGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 2, 2018·11 cites·10 claims
- 1295US9038133B2Self-authenticating of chip based on intrinsic featuresIBM·Filed 2012·Granted May 19, 2015·24 cites·16 claims
- 1395US9025386B1Embedded charge trap multi-time-programmable-read-only-memory for high performance logic technologyIBM·Filed 2013·Granted May 5, 2015·27 cites·20 claims
- 1494US9690927B2Providing an authenticating service of a chipIBM·Filed 2015·Granted Jun 27, 2017·11 cites·20 claims
- 1594US9208878B2Non-volatile memory based on retention modulationIBM·Filed 2014·Granted Dec 8, 2015·19 cites·20 claims
- 1694US5937312ASingle-etch stop process for the manufacture of silicon-on-insulator wafersSIBOND L L C·Filed 1996·Granted Aug 10, 1999·355 cites·39 claims
- 1793US9160617B2Faulty core recovery mechanisms for a three-dimensional network on a processor arrayIBM·Filed 2012·Granted Oct 13, 2015·16 cites·25 claims
- 1893US5525828AHigh speed silicon-based lateral junction photodetectors having recessed electrodes and thick oxide to reduce fringing fieldsIBM·Filed 1994·Granted Jun 11, 1996·138 cites·16 claims
- 1992US7682896B2Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating sameIBM·Filed 2007·Granted Mar 23, 2010·20 cites·18 claims
- 2092US6433404B1Electrical fuses for semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 13, 2002·113 cites·18 claims
- 2191US8674515B23D integrated circuits structureFAROOQ MUKTA G·Filed 2012·Granted Mar 18, 2014·11 cites·11 claims
- 2291US7388244B2Trench metal-insulator-metal (MIM) capacitors and method of fabricating sameIBM·Filed 2005·Granted Jun 17, 2008·21 cites·15 claims
- 2391US6287913B1Double polysilicon process for providing single chip high performance logic and compact embedded memory structureIBM·Filed 1999·Granted Sep 11, 2001·76 cites·34 claims
- 2491US4997246ASilicon-based rib waveguide optical modulatorIBM·Filed 1989·Granted Mar 5, 1991·78 cites·18 claims
- 2590US7982285B2Antifuse structure having an integrated heating elementIBM·Filed 2008·Granted Jul 19, 2011·14 cites·20 claims
- 2690US5667586AMethod for forming a single crystal semiconductor on a substrateIBM·Filed 1996·Granted Sep 16, 1997·78 cites·11 claims
- 2789US9406561B2Three dimensional integrated circuit integration using dielectric bonding first and through via formation lastFAROOQ MUKTA G·Filed 2009·Granted Aug 2, 2016·19 cites·27 claims
- 2889US8822141B1Front side wafer ID processingIBM·Filed 2013·Granted Sep 2, 2014·10 cites·12 claims
- 2989US8487425B2Optimized annular copper TSVANDRY PAUL S·Filed 2011·Granted Jul 16, 2013·9 cites·15 claims
- 3089US6323535B1Electrical fuses employing reverse biasing to enhance programmingINFINEON TECHNOLOGIES CORP·Filed 2000·Granted Nov 27, 2001·56 cites·16 claims
- 3189US6261876B1Planar mixed SOI-bulk substrate for microelectronic applicationsIBM·Filed 1999·Granted Jul 17, 2001·93 cites·15 claims
- 3289US5310451AMethod of forming an ultra-uniform silicon-on-insulator layerIBM·Filed 1993·Granted May 10, 1994·121 cites·17 claims
- 3388US9436845B2Physically unclonable fuse using a NOR type memory arrayGLOBALFOUNDRIES US 2 LLC·Filed 2014·Granted Sep 6, 2016·11 cites·7 claims
- 3488US6096580ALow programming voltage anti-fuseIBM·Filed 1999·Granted Aug 1, 2000·99 cites·15 claims
- 3588US5268324AModified silicon CMOS process having selectively deposited Si/SiGe FETSIBM·Filed 1992·Granted Dec 7, 1993·79 cites·8 claims
- 3687US7200064B1Apparatus and method for providing a reprogrammable electrically programmable fuseIBM·Filed 2005·Granted Apr 3, 2007·20 cites·35 claims
- 3787US6686617B2Semiconductor chip having both compact memory and high performance logicIBM·Filed 2001·Granted Feb 3, 2004·36 cites·8 claims
- 3886US9940302B2Interconnect circuits at three dimensional (3-D) bonding interfaces of a processor arrayIBM·Filed 2016·Granted Apr 10, 2018·4 cites·20 claims
- 3986US8990616B2Final faulty core recovery mechanisms for a two-dimensional network on a processor arrayIBM·Filed 2012·Granted Mar 24, 2015·9 cites·25 claims
- 4086US8492869B23D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layerFAROOQ MUKTA G·Filed 2012·Granted Jul 23, 2013·5 cites·20 claims
- 4186US7939369B23D integration structure and method using bonded metal planesIBM·Filed 2009·Granted May 10, 2011·14 cites·25 claims
- 4286US7750388B2Trench metal-insulator metal (MIM) capacitorsIBM·Filed 2007·Granted Jul 6, 2010·12 cites·14 claims
- 4385US9588937B2Array of processor core circuits with reversible tiersIBM·Filed 2013·Granted Mar 7, 2017·7 cites·20 claims
- 4485US8658535B2Optimized annular copper TSVIBM·Filed 2013·Granted Feb 25, 2014·8 cites·11 claims
- 4585US8590010B2Retention based intrinsic fingerprint identification featuring a fuzzy algorithm and a dynamic keyFAINSTEIN DANIEL J·Filed 2011·Granted Nov 19, 2013·15 cites·13 claims
- 4685US8227304B2Semiconductor-on-insulator (SOI) structure and method of forming the SOI structure using a bulk semiconductor starting waferIYER SUBRAMANIAN S·Filed 2010·Granted Jul 24, 2012·7 cites·24 claims
- 4785US4638347AGate electrode sidewall isolation spacer for field effect transistorsIBM·Filed 1985·Granted Jan 20, 1987·46 cites·11 claims
- 4884US9029988B2Through silicon via in n+ epitaxy wafers with reduced parasitic capacitanceIBM·Filed 2013·Granted May 12, 2015·4 cites·5 claims
- 4984US8298914B23D integrated circuit device fabrication using interface wafer as permanent carrierFAROOQ MUKTA G·Filed 2008·Granted Oct 30, 2012·7 cites·10 claims
- 5083US7880266B2Four-terminal antifuse structure having integrated heating elements for a programmable circuitIBM·Filed 2007·Granted Feb 1, 2011·8 cites·32 claims
Showing the top 50 of 132 patent records by PatentIndex Score.
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