Inventor · disambiguated record
Fumio Miyano
Also filed as: MIYANO FUMIO
8 granted patents·73 citations·filing 1997–2007
86Inventor score
Technology areasH10W
Files withSHINKAWA KK8
Top patents by PatentIndex Score
8 records- 0176US6491202B1Wire bonding apparatus and methodSHINKAWA KK·Filed 2000·Granted Dec 10, 2002·23 cites·2 claims
- 0272US7644852B2Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatusSHINKAWA KK·Filed 2007·Granted Jan 12, 2010·7 cites·4 claims
- 0370US7658313B2Ball forming device in a bonding apparatus and ball forming methodSHINKAWA KK·Filed 2007·Granted Feb 9, 2010·5 cites·6 claims
- 0464US6467679B2Wire bonding methodSHINKAWA KK·Filed 2001·Granted Oct 22, 2002·11 cites·1 claims
- 0552US6874673B2Initial ball forming method for wire bonding wire and wire bonding apparatusSHINKAWA KK·Filed 2003·Granted Apr 5, 2005·5 cites·8 claims
- 0648US7299966B2Initial ball forming method for wire bonding wire and wire bonding apparatusSHINKAWA KK·Filed 2003·Granted Nov 27, 2007·3 cites·10 claims
- 0742US5958259AMethod for forming a ball in wire bondingSHINKAWA KK·Filed 1997·Granted Sep 28, 1999·11 cites·1 claims
- 0839US5957371AMethod and apparatus for forming a ball in wire bondingSHINKAWA KK·Filed 1997·Granted Sep 28, 1999·8 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Fumio Miyano files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →