Inventor · disambiguated record

Ryusuke Kawanaka

Also filed as: KAWANAKA RYUSUKE

2 granted patents·23 citations·filing 1983–1986

60Inventor score

Technology areasH10W

Files withMITSUBISHI METAL CORP2

Top patents by PatentIndex Score

2 records

0144US4726859AWire for bonding a semiconductor deviceMITSUBISHI METAL CORP·Filed 1986·Granted Feb 23, 1988·13 cites·4 claims
0242US4512950ALead alloy soft solder containing radioactive particles used to make more reliable semiconductor devicesMITSUBISHI METAL CORP·Filed 1983·Granted Apr 23, 1985·10 cites·2 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →