Inventor · disambiguated record
Naoyuki Hosoda
Also filed as: HOSODA NAOYUKI
11 granted patents·191 citations·filing 1974–1994
92Inventor score
Top patents by PatentIndex Score
11 records- 0178US5120589AComposite cardsMITSUBISHI MATERIALS CORP·Filed 1990·Granted Jun 9, 1992·37 cites·17 claims
- 0276US3944414ATreatment of anode slime from copper electrolysisMITSUBISHI METAL CORP·Filed 1974·Granted Mar 16, 1976·20 cites·9 claims
- 0363US4885135AFine gold alloy wire for bonding of a semi-conductor deviceMITSUBISHI METAL CORP·Filed 1989·Granted Dec 5, 1989·23 cites·4 claims
- 0463US4676827AWire for bonding a semiconductor device and process for producing the sameMITSUBISHI METAL CORP·Filed 1986·Granted Jun 30, 1987·23 cites·10 claims
- 0554US5626937AComposite cardsMITSUBISHI MATERIALS CORP·Filed 1994·Granted May 6, 1997·18 cites·7 claims
- 0651US5364482AComposite cardsMITSUBISHI MATERIALS CORP·Filed 1992·Granted Nov 15, 1994·17 cites·18 claims
- 0750US5071619AFine gold alloy wire for bonding of a semiconductor deviceMITSUBISHI METAL CORP·Filed 1989·Granted Dec 10, 1991·13 cites·58 claims
- 0845US4717436AWire for bonding a semiconductor deviceMITSUBISHI METAL CORP·Filed 1987·Granted Jan 5, 1988·10 cites·2 claims
- 0944US4726859AWire for bonding a semiconductor deviceMITSUBISHI METAL CORP·Filed 1986·Granted Feb 23, 1988·13 cites·4 claims
- 1044US4663141AProcess for recovering or purifying seleniumMITSUBISHI METAL CORP·Filed 1985·Granted May 5, 1987·7 cites·7 claims
- 1142US4512950ALead alloy soft solder containing radioactive particles used to make more reliable semiconductor devicesMITSUBISHI METAL CORP·Filed 1983·Granted Apr 23, 1985·10 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →