Inventor · disambiguated record
Raju Ahmed
Also filed as: AHMED RAJU
11 granted patents·1 pending application·5 citations·filing 2019–2024
82Inventor score
Top patents by PatentIndex Score
12 records- 0182US12438083B2Assemblies having conductive interconnects which are laterally and vertically offset relative to one anotherMICRON TECHNOLOGY INC·Filed 2024·Granted Oct 7, 2025·0 cites·12 claims
- 0281US11515204B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·1 cites·25 claims
- 0381US11328749B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2019·Granted May 10, 2022·3 cites·20 claims
- 0480US12387981B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0575US12014983B2Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one anotherMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 18, 2024·0 cites·9 claims
- 0675US2025079188A1Incorporating semiconductors on a polycrystalline diamond substrateTEXAS STATE UNIV·Filed 2024·Application pending·0 cites
- 0774US11990370B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0873US12176221B2Incorporating semiconductors on a polycrystalline diamond substrateTEXAS STATE UNIV·Filed 2019·Granted Dec 24, 2024·1 cites·10 claims
- 0967US11482492B2Assemblies having conductive interconnects which are laterally and vertically offset relative to one anotherMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 25, 2022·0 cites·29 claims
- 1064US12463129B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·21 claims
- 1163US11978527B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1257US11545391B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·58 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →