Inventor · disambiguated record
Fandong Liu
Also filed as: LIU FANDONG
16 granted patents·14 pending applications·29 citations·filing 2018–2025
90Inventor score
Top patents by PatentIndex Score
30 records- 0196US11222903B2Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 11, 2022·4 cites·20 claims
- 0295US11903195B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Feb 13, 2024·2 cites·19 claims
- 0393US10804283B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Oct 13, 2020·8 cites·6 claims
- 0490US11574919B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·17 claims
- 0589US10651192B2Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 12, 2020·4 cites·16 claims
- 0684US12232320B2Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·18 claims
- 0783US12356616B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0883US10854621B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Dec 1, 2020·3 cites·20 claims
- 0983US2025294742A1Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1079US10861872B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 1178US10784279B2Methods for reducing defects in semiconductor plug in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Sep 22, 2020·2 cites·17 claims
- 1278US10522561B2Method for forming a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 1377US11792989B2Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
- 1477US2025176182A1Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1564US11289508B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·11 claims
- 1662US2025151257A1Semiconductor devices and fabrication methods thereof, and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1762US2024365533A1Semiconductor device, fabrication method of semiconductor device and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1861US11177270B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 1959US11205662B2Methods for reducing defects in semiconductor plug in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 2059US2025006494A1Patterning methods, semiconductor structures and memoryYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025107063A1Forming Connect Structures in Memory SystemsYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2258US2024422965A1Semiconductor devices and fabrication methods thereof and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2357US2024032285A1Word-line-pickup structure and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2457US2024349479A1Simplified manufacture of semiconductor memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2557US2024306366A1Semiconductor structure and method for preparing sameICLEAGUE TECH CO LTD·Filed 2024·Application pending·0 cites
- 2656US2023380137A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2756US2024038856A1Semiconductor devices and manufacturing methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2848US2025071978A1Semiconductor structure, and method for forming semiconductor structureICLEAGUE TECH CO LTD·Filed 2022·Application pending·0 cites
- 2942US12185521B2Method for manufacturing memory device and memoryICLEAGUE TECH CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·10 claims
- 3041US2019013326A1Composite substrate of three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →