Inventor · disambiguated record
Michael George Todd
Also filed as: TODD MICHAEL · TODD MICHAEL G · TODD MICHAEL GEORGE
34 granted patents·3 pending applications·1,449 citations·filing 1991–2009
98Inventor score
Files withFORD MOTOR CO22HENKEL CORP4VISTEON GLOBAL TECH INC4TORANAGA TECHNOLOGIES INC3FORD GLOBAL TECH INC2
Top patents by PatentIndex Score
37 records- 0195US5938455AThree-dimensional molded circuit board having interlocking connectionsFORD MOTOR CO·Filed 1996·Granted Aug 17, 1999·103 cites·21 claims
- 0294US5376403AElectrically conductive compositions and methods for the preparation and use thereofFiled 1991·Granted Dec 27, 1994·177 cites·6 claims
- 0392US5830389AElectrically conductive compositions and methods for the preparation and use thereofTORANAGA TECHNOLOGIES INC·Filed 1994·Granted Nov 3, 1998·140 cites·26 claims
- 0489US5706170AVentilation duct with integrated electronics enclosureFORD MOTOR CO·Filed 1996·Granted Jan 6, 1998·60 cites·10 claims
- 0587US5986884AMethod for cooling electronic componentsFORD MOTOR CO·Filed 1998·Granted Nov 16, 1999·61 cites·23 claims
- 0687US5538789AComposite substrates for preparation of printed circuitsTORANAGA TECHNOLOGIES INC·Filed 1994·Granted Jul 23, 1996·81 cites·18 claims
- 0786US5738797AThree-dimensional multi-layer circuit structure and method for forming the sameFORD GLOBAL TECH INC·Filed 1996·Granted Apr 14, 1998·67 cites·18 claims
- 0882US5994648AThree-dimensional molded sockets for mechanical and electrical component attachmentFORD MOTOR CO·Filed 1997·Granted Nov 30, 1999·58 cites·14 claims
- 0982US5929375AEMI protection and CTE control of three-dimensional circuitized substratesFORD MOTOR CO·Filed 1996·Granted Jul 27, 1999·53 cites·13 claims
- 1081US5565267AComposite substrates for preparation of printed circuitsTORANAGA TECHNOLOGIES INC·Filed 1995·Granted Oct 15, 1996·59 cites·17 claims
- 1180US5715140AOverlay substrate for securing electronic devices in a vehicleFORD MOTOR CO·Filed 1996·Granted Feb 3, 1998·45 cites·9 claims
- 1279US5783867ARepairable flip-chip undercoating assembly and method and material for sameFORD MOTOR CO·Filed 1995·Granted Jul 21, 1998·61 cites·3 claims
- 1376US6197145B1Method of laminating a flexible circuit to a substrateFORD MOTOR CO·Filed 1998·Granted Mar 6, 2001·37 cites·18 claims
- 1475US5702584AEnhanced plating adhesion through the use of metallized fillers in plastic substrateFORD MOTOR CO·Filed 1996·Granted Dec 30, 1997·38 cites·5 claims
- 1574US6326241B1Solderless flip-chip assembly and method and material for sameVISTEON GLOBAL TECH INC·Filed 1997·Granted Dec 4, 2001·48 cites·10 claims
- 1674US5752851ACircuit clip connectorFORD MOTOR CO·Filed 1996·Granted May 19, 1998·38 cites·1 claims
- 1771US5925298AMethod for reworking a multi-layer circuit board using a shape memory alloy materialFORD MOTOR CO·Filed 1995·Granted Jul 20, 1999·33 cites·10 claims
- 1871US5654081AIntegrated circuit assembly with polymeric underfill bodyFORD MOTOR CO·Filed 1995·Granted Aug 5, 1997·39 cites·6 claims
- 1968US5909012AMethod of making a three-dimensional part with buried conductorsFORD MOTOR CO·Filed 1996·Granted Jun 1, 1999·27 cites·11 claims
- 2066US6076950AIntegrated lighting assemblyFORD GLOBAL TECH INC·Filed 1998·Granted Jun 20, 2000·23 cites·20 claims
- 2165US6555015B1Multi-layer printed circuit board and method of making sameVISTEON GLOBAL TECH INC·Filed 2000·Granted Apr 29, 2003·10 cites·16 claims
- 2265US6100178AThree-dimensional electronic circuit with multiple conductor layers and method for manufacturing sameFORD MOTOR CO·Filed 1997·Granted Aug 8, 2000·25 cites·10 claims
- 2364US5909839AMethod for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pinsFORD MOTOR CO·Filed 1997·Granted Jun 8, 1999·24 cites·3 claims
- 2462US5914534AThree-dimensional multi-layer molded electronic device and method for manufacturing sameFORD MOTOR CO·Filed 1996·Granted Jun 22, 1999·27 cites·16 claims
- 2560US7582510B2Electronic packaging materials for use with low-k dielectric-containing semiconductor devicesHENKEL CORP·Filed 2004·Granted Sep 1, 2009·10 cites·12 claims
- 2660US5837609AFully additive method of applying a circuit pattern to a three-dimensional, nonconductive partFORD MOTOR CO·Filed 1997·Granted Nov 17, 1998·18 cites·10 claims
- 2759US5878487AMethod of supporting an electrical circuit on an electrically insulative base substrateFORD MOTOR CO·Filed 1996·Granted Mar 9, 1999·20 cites·11 claims
- 2858US5705104AMethod for embedding conductors in a structureFORD MOTOR CO·Filed 1996·Granted Jan 6, 1998·22 cites·19 claims
- 2955US6882058B2Organic acid containing compositions and methods for use thereofHENKEL CORP·Filed 2002·Granted Apr 19, 2005·9 cites·22 claims
- 3047US6740246B2Circuit board and a method for making the sameVISTEON GLOBAL TECH INC·Filed 2001·Granted May 25, 2004·2 cites·16 claims
- 3147US2010140542A1Benzoxazine containing compositions of matter and curable compositions made therewithHENKEL CORP·Filed 2009·Application pending·0 cites
- 3244US5882954AMethod for adhering a metallization to a substrateFORD MOTOR CO·Filed 1997·Granted Mar 16, 1999·11 cites·20 claims
- 3344US5655291AForming rigid circuit boardFORD MOTOR CO·Filed 1995·Granted Aug 12, 1997·10 cites·7 claims
- 3436US5639010ASimultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devicesFORD MOTOR CO·Filed 1995·Granted Jun 17, 1997·10 cites·5 claims
- 3534US2007261883A1Methods For Improving The Flux Compatibility Of Underfill FormulationsCHAN BRUCE C·Filed 2005·Application pending·0 cites
- 3634US2008051524A1Epoxy-Based Compositions Having Improved Impact ResistanceHENKEL CORP·Filed 2006·Application pending·0 cites
- 3733US6528736B1Multi-layer printed circuit board and method of making sameVISTEON GLOBAL TECH INC·Filed 1997·Granted Mar 4, 2003·3 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →