Inventor · disambiguated record
Ashwani K. Malhotra
Also filed as: MALHOTRA ASHWANI · MALHOTRA ASHWANI K
11 granted patents·1 pending application·227 citations·filing 1997–2023
90Inventor score
Top patents by PatentIndex Score
12 records- 0193US6036809AProcess for releasing a thin-film structure from a substrateIBM·Filed 1999·Granted Mar 14, 2000·112 cites·15 claims
- 0282US6183588B1Process for transferring a thin-film structure to a substrateIBM·Filed 1999·Granted Feb 6, 2001·52 cites·15 claims
- 0369US6143117AProcess for transferring a thin-film structure to a temporary carrierIBM·Filed 1999·Granted Nov 7, 2000·28 cites·10 claims
- 0458US7674637B2Monitoring cool-down stress in a flip chip process using monitor solder bump structuresIBM·Filed 2007·Granted Mar 9, 2010·1 cites·12 claims
- 0558US2024026227A1Improved configuration of vacuum distillation unit and process for separating components of reduced crude oilENGINEERS INDIA LTD·Filed 2023·Application pending·0 cites
- 0657US6077405AMethod and apparatus for making electrical contact to a substrate during electroplatingIBM·Filed 1998·Granted Jun 20, 2000·11 cites·17 claims
- 0753US6235412B1Corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 2000·Granted May 22, 2001·4 cites·16 claims
- 0849US7851911B2Semiconductor chip used in flip chip processIBM·Filed 2010·Granted Dec 14, 2010·0 cites·8 claims
- 0946US6002267AIn-line voltage plane tests for multi-chip modulesIBM·Filed 1997·Granted Dec 14, 1999·14 cites·16 claims
- 1045US6241868B1Method for electroplating a film onto a substrateIBM·Filed 2000·Granted Jun 5, 2001·0 cites·14 claims
- 1137US6083375AProcess for producing corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 1998·Granted Jul 4, 2000·5 cites·23 claims
- 1227US6188124B1Semiconductor arrangement preventing damage during contact processingIBM·Filed 1999·Granted Feb 13, 2001·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →