Inventor · disambiguated record
Hiroyuki Takasaka
Also filed as: TAKASAKA HIROYUKI
5 granted patents·71 citations·filing 1994–2008
81Inventor score
Top patents by PatentIndex Score
5 records- 0163US8178191B2Multilayer wiring board and method of making the sameNISHINO SHIGEO·Filed 2008·Granted May 15, 2012·5 cites·5 claims
- 0262US5635009AMethod for sticking an insulating film to a lead frameHITACHI CABLE·Filed 1994·Granted Jun 3, 1997·28 cites·2 claims
- 0358US5837368AInsulating film with improved punching characteristics and lead frame using the sameHITACHI CABLE·Filed 1996·Granted Nov 17, 1998·22 cites·6 claims
- 0443US5593774AInsulating film with improved punching characteristics and lead frame using the sameHITACHI CABLE·Filed 1996·Granted Jan 14, 1997·11 cites·3 claims
- 0535USRE37323EMethod for sticking an insulating film to a lead frameHITACHI CABLE·Filed 1999·Granted Aug 14, 2001·5 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →