Inventor · disambiguated record
Noriyuki Isobe
Also filed as: ISOBE NORIYUKI
17 granted patents·9 pending applications·1,053 citations·filing 1986–2025
95Inventor score
Files withUBE INDUSTRIES10KOKUSAI ELECTRIC CORP5HITACHI INT ELECTRIC INC3TOYO TIRE & RUBBER CO3ASAHI GLASS CO LTD2
Top patents by PatentIndex Score
26 records- 0198US10297440B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 21, 2019·345 cites·7 claims
- 0298US9708708B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 18, 2017·465 cites·14 claims
- 0391US6855787B2Multi-layer hoseASAHI GLASS CO LTD·Filed 2003·Granted Feb 15, 2005·45 cites·12 claims
- 0482US10876207B2Substrate processing apparatus, liquid precursor replenishment system, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 29, 2020·3 cites·11 claims
- 0578US11201054B2Method of manufacturing semiconductor device having higher exhaust pipe temperature and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 14, 2021·2 cites·12 claims
- 0678US6656553B2Hose for fuelASAHI GLASS CO LTD·Filed 2002·Granted Dec 2, 2003·19 cites·14 claims
- 0778US2025313674A1Cellulose molded body and hydrogel, and method for producing the sameJAPAN AGENCY MARINE EARTH SCI·Filed 2025·Application pending·0 cites
- 0877US6538099B2Nylon 12 compositionUBE INDUSTRIES·Filed 2001·Granted Mar 25, 2003·21 cites·4 claims
- 0975US4908401ARubber composition for tire treadTOYO TIRE & RUBBER CO·Filed 1988·Granted Mar 13, 1990·27 cites·5 claims
- 1074US5789529APolyamide resin composition and tubular molding comprising the sameUBE INDUSTRIES·Filed 1996·Granted Aug 4, 1998·34 cites·16 claims
- 1171US2022389173A1Cellulose molded body and hydrogel, and method for producing the sameJAPAN AGENCY MARINE EARTH SCI·Filed 2020·Application pending·0 cites
- 1268US4808659AAdhesive composition comprising organometallic polymerUBE INDUSTRIES·Filed 1986·Granted Feb 28, 1989·19 cites·10 claims
- 1362US4946887ATire tread rubber composition and tire for passenger carTOYO TIRE & RUBBER CO·Filed 1988·Granted Aug 7, 1990·19 cites·4 claims
- 1462US4929507AHeat-resistant paint comprising polymetallocarbosilaneUBE INDUSTRIES·Filed 1988·Granted May 29, 1990·18 cites·8 claims
- 1561US5195357AMethod for measuring resistance to slippageTOYO TIRE & RUBBER CO·Filed 1992·Granted Mar 23, 1993·25 cites·18 claims
- 1660US2025006490A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1759US2024287672A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1854US2004206412A1Nylon resin multi-layer pipe and method for adhering sameUBE INDUSTRIES·Filed 2004·Application pending·0 cites
- 1952US2004171764A1Joint to be adhered to nylon resin moldingsUBE INDUSTRIES·Filed 2003·Application pending·0 cites
- 2052US2003131936A1Nylon resin multi-layer pipe and method for adhering sameUBE INDUSTRIES·Filed 2003·Application pending·0 cites
- 2149US6541085B2Tubular molded product using nylon 12UBE INDUSTRIES·Filed 2001·Granted Apr 1, 2003·3 cites·4 claims
- 2248US11299804B2Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 12, 2022·0 cites·9 claims
- 2345US2002066526A1Joint to be adhered to nylon resin moldingsUBE INDUSTRIES·Filed 2001·Application pending·0 cites
- 2442US6294644B1Nylon 12, nylon composition, method for producing nylon 12, and tubular molded product using nylon 12UBE INDUSTRIES·Filed 1999·Granted Sep 25, 2001·8 cites·4 claims
- 2540US2004135371A1Fuel pipe joint with excellent fuel permeation resistanceKURARAY CO LTD A JAPANESE CORP·Filed 2003·Application pending·0 cites
- 2636US11001923B2Method of manufacturing semiconductor device and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted May 11, 2021·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Noriyuki Isobe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →