Inventor · disambiguated record
Divya Mani
Also filed as: MANI DIVYA
4 granted patents·3 pending applications·5 citations·filing 2017–2021
62Inventor score
Technology areasH10W
Files withINTEL CORP7
Top patents by PatentIndex Score
7 records- 0181US11112841B25G mmWave cooling through PCBINTEL CORP·Filed 2017·Granted Sep 7, 2021·3 cites·14 claims
- 0274US11640929B2Thermal management solutions for cored substratesINTEL CORP·Filed 2018·Granted May 2, 2023·2 cites·20 claims
- 0361US2022256715A15G mmWAVE COOLING THROUGH PCBINTEL CORP·Filed 2021·Application pending·0 cites
- 0446US11830783B2Embedded substrate heat sink for bottom side coolingINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 0544US11581240B2Liquid thermal interface material in electronic packagingINTEL CORP·Filed 2018·Granted Feb 14, 2023·0 cites·20 claims
- 0643US2021259134A1Substrate cooling using heat pipe vapor chamber stiffener and ihs legsINTEL CORP·Filed 2020·Application pending·0 cites
- 0738US2020219789A1Thermal management solutions for integrated circuit assemblies using phase change materialsINTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →