Inventor · disambiguated record
Kedar Dhane
Also filed as: DHANE KEDAR
5 granted patents·3 pending applications·7 citations·filing 2015–2018
70Inventor score
Technology areasH10W
Files withINTEL CORP8
Top patents by PatentIndex Score
8 records- 0174US9799610B2Plurality of stiffeners with thickness variationINTEL CORP·Filed 2015·Granted Oct 24, 2017·3 cites·22 claims
- 0271US10290561B2Thermal interfaces for integrated circuit packagesINTEL CORP·Filed 2016·Granted May 14, 2019·2 cites·13 claims
- 0366US10461003B2Electronic package that includes multiple supportsINTEL CORP·Filed 2016·Granted Oct 29, 2019·1 cites·16 claims
- 0465US10157860B2Component stiffener architectures for microelectronic package structuresINTEL CORP·Filed 2016·Granted Dec 18, 2018·1 cites·23 claims
- 0544US11581240B2Liquid thermal interface material in electronic packagingINTEL CORP·Filed 2018·Granted Feb 14, 2023·0 cites·20 claims
- 0643US2017170087A1Electronic package that includes multiple supportsINTEL CORP·Filed 2015·Application pending·0 cites
- 0738US2020203470A1Magnetic mold material inductors for electronic packagesINTEL CORP·Filed 2018·Application pending·0 cites
- 0829US2016268213A1On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI RisksINTEL CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kedar Dhane files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →