Inventor · disambiguated record
Mohsen H. Mardi
Also filed as: MARDI MOHSEN · MARDI MOHSEN H · MARDI MOHSEN HOSSEIN
45 granted patents·2 pending applications·649 citations·filing 1999–2024
98Inventor score
Top patents by PatentIndex Score
47 records- 0197US7138811B1Seals used for testing on an integrated circuit testerXILINX INC·Filed 2005·Granted Nov 21, 2006·51 cites·20 claims
- 0295US10564212B2Integrated circuit package testing systemXILINX INC·Filed 2017·Granted Feb 18, 2020·7 cites·20 claims
- 0395US6541991B1Interface apparatus and method for testing different sized ball grid array integrated circuitsXILINX INC·Filed 2001·Granted Apr 1, 2003·116 cites·12 claims
- 0494US6958616B1Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pinsXILINX INC·Filed 2003·Granted Oct 25, 2005·77 cites·7 claims
- 0593US7180318B1Multi-pitch test probe assembly for testing semiconductor dies having contact padsXILINX INC·Filed 2004·Granted Feb 20, 2007·63 cites·24 claims
- 0691US11043484B1Method and apparatus of package enabled ESD protectionXILINX INC·Filed 2019·Granted Jun 22, 2021·8 cites·20 claims
- 0791US10665579B2Chip package assembly with power management integrated circuit and integrated circuit dieXILINX INC·Filed 2016·Granted May 26, 2020·8 cites·20 claims
- 0889US11476556B1Remote active cooling heat exchanger and antenna system with the sameXILINX INC·Filed 2020·Granted Oct 18, 2022·2 cites·20 claims
- 0989US9947560B1Integrated circuit package, and methods and tools for fabricating the sameXILINX INC·Filed 2016·Granted Apr 17, 2018·7 cites·7 claims
- 1089US8987009B1Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) productXILINX INC·Filed 2013·Granted Mar 24, 2015·8 cites·12 claims
- 1189US8269516B1High-speed contactor interconnect with circuitryMARDI MOHSEN H·Filed 2009·Granted Sep 18, 2012·18 cites·15 claims
- 1288US10367279B2Pusher pin having a non-electrically conductive portionXILINX INC·Filed 2017·Granted Jul 30, 2019·3 cites·20 claims
- 1388US8310253B1Hybrid probe cardMARDI MOHSEN H·Filed 2009·Granted Nov 13, 2012·20 cites·20 claims
- 1488US7083428B1Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pinsXILINX INC·Filed 2005·Granted Aug 1, 2006·16 cites·17 claims
- 1587US12048083B2Micro device with adaptable thermal management deviceXILINX INC·Filed 2021·Granted Jul 23, 2024·1 cites·20 claims
- 1685US7837481B1Socket for an integrated circuit and a method of providing a connection in a socketXILINX INC·Filed 2008·Granted Nov 23, 2010·24 cites·20 claims
- 1784US10838018B1Multiple insertion testing of test socketXILINX INC·Filed 2018·Granted Nov 17, 2020·3 cites·19 claims
- 1884US10539610B2Chip package test systemXILINX INC·Filed 2017·Granted Jan 21, 2020·2 cites·19 claims
- 1984US7598727B1Probe card head protection device for wafer sort set upXILINX INC·Filed 2006·Granted Oct 6, 2009·14 cites·14 claims
- 2084US6359248B1Method for marking packaged integrated circuitsXILINX INC·Filed 1999·Granted Mar 19, 2002·63 cites·5 claims
- 2183US10613137B2Probe head securing mechanism for probe assemblyXILINX INC·Filed 2017·Granted Apr 7, 2020·3 cites·20 claims
- 2280US10520544B2Versatile testing systemXILINX INC·Filed 2016·Granted Dec 31, 2019·2 cites·19 claims
- 2379US10571517B1Probe head assemblyXILINX INC·Filed 2017·Granted Feb 25, 2020·2 cites·18 claims
- 2478US9123738B1Transmission line via structureXILINX INC·Filed 2014·Granted Sep 1, 2015·3 cites·20 claims
- 2577US8659169B2Corner structure for IC dieMARDI MOHSEN H·Filed 2010·Granted Feb 25, 2014·5 cites·20 claims
- 2677US8542029B1Methods and apparatus for testing of integrated circuitsMARDI MOHSEN HOSSEIN·Filed 2009·Granted Sep 24, 2013·9 cites·19 claims
- 2776US6891384B2Multi-socket board for open/short testerXILINX INC·Filed 2002·Granted May 10, 2005·23 cites·12 claims
- 2874US7535239B1Probe card configured for interchangeable headsXILINX INC·Filed 2006·Granted May 19, 2009·8 cites·19 claims
- 2973US7235412B1Semiconductor component having test pads and method and apparatus for testing sameXILINX INC·Filed 2004·Granted Jun 26, 2007·19 cites·14 claims
- 3072US7888954B1Method of utilizing an interposer in an automated test system and an automated test system having an interposerXILINX INC·Filed 2008·Granted Feb 15, 2011·6 cites·20 claims
- 3172US7737439B2Semiconductor component having test pads and method and apparatus for testing sameXILINX INC·Filed 2007·Granted Jun 15, 2010·5 cites·20 claims
- 3272US7381908B1Circuit board stiffenerCANTATORE COSIMO·Filed 2005·Granted Jun 3, 2008·10 cites·11 claims
- 3371US10168384B2Modular testing system with versatile robotXILINX INC·Filed 2016·Granted Jan 1, 2019·1 cites·20 claims
- 3469US8269519B1Methods and apparatus for testing of integrated circuitsMARDI MOHSEN HOSSEIN·Filed 2009·Granted Sep 18, 2012·5 cites·13 claims
- 3567US9236367B1Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) productXILINX INC·Filed 2015·Granted Jan 12, 2016·1 cites·17 claims
- 3666US7352197B1Octal/quad site docking compatibility for package test handlerXILINX INC·Filed 2005·Granted Apr 1, 2008·5 cites·13 claims
- 3765US6674036B1Method for marking packaged integrated circuitsXILINX INC·Filed 2001·Granted Jan 6, 2004·10 cites·14 claims
- 3862US8493071B1Shorted test structureMARDI MOHSEN H·Filed 2009·Granted Jul 23, 2013·4 cites·20 claims
- 3962US2025149390A1Wafer process for probing bump placement on multiple small power pads without displacing surrounding signal padsXILINX INC·Filed 2024·Application pending·0 cites
- 4060US2025174501A1Probing bump placement over multiple via openingsXILINX INC·Filed 2024·Application pending·0 cites
- 4158US7285973B1Methods for standardizing a test head assemblyXILINX INC·Filed 2002·Granted Oct 23, 2007·8 cites·20 claims
- 4257US10527670B2Testing system for lid-less integrated circuit packagesXILINX INC·Filed 2017·Granted Jan 7, 2020·0 cites·20 claims
- 4356US6809524B1Testing of conducting paths using a high speed I/O test packageXILINX INC·Filed 2003·Granted Oct 26, 2004·7 cites·19 claims
- 4452US10823759B2Test system and method of testing a wafer for integrated circuit devicesXILINX INC·Filed 2018·Granted Nov 3, 2020·0 cites·20 claims
- 4549US8269518B1Method and apparatus for preventing probe card oxidationDANG ELVIN P·Filed 2009·Granted Sep 18, 2012·2 cites·20 claims
- 4647US10096502B2Method and apparatus for assembling and testing a multi-integrated circuit packageXILINX INC·Filed 2016·Granted Oct 9, 2018·0 cites·16 claims
- 4743US10783308B1Method of assigning contact elements associated with an integrated circuit deviceXILINX INC·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →