Inventor · disambiguated record
Sheng-Yang Peng
Also filed as: PENG SHENG · PENG SHENG-YANG
10 granted patents·7 pending applications·50 citations·filing 2003–2019
86Inventor score
Files withADVANCED SEMICONDUCTOR ENG7PENG SHENG-YANG4CYCARRIER TECH CO LTD1CYCRAFT SINGAPORE PTE LTD1MICROSOFT CORP1
Top patents by PatentIndex Score
17 records- 0191US9342220B2Process modeling and interfaceMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2013·Granted May 17, 2016·15 cites·15 claims
- 0275US7573124B2Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 11, 2009·7 cites·11 claims
- 0366US8573766B2Distributed light sources and systems for photo-reactive curingYANG GUOMAO·Filed 2011·Granted Nov 5, 2013·2 cites·28 claims
- 0460USD922402SDisplay screen or portion thereof with animated graphical user interfaceCYCARRIER TECH CO LTD·Filed 2019·Granted Jun 15, 2021·9 cites·1 claims
- 0557USD919635SDisplay screen or portion thereof with graphical user interfaceCYCRAFT SINGAPORE PTE LTD·Filed 2019·Granted May 18, 2021·8 cites·1 claims
- 0656US6801429B2Package structure compatible with cooling systemADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Oct 5, 2004·7 cites·6 claims
- 0749US2013292803A1Chip structure and wafer structureADVANCED SEMICONDUCTOR ENG·Filed 2013·Application pending·0 cites
- 0846US7611967B2Wafer sawing methodADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 3, 2009·0 cites·7 claims
- 0946US7071553B2Package structure compatible with cooling systemADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 4, 2006·2 cites·7 claims
- 1046US2009140413A1Semiconductor package structure, applications thereof and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1145US2008230885A1Chip hermetic package device and method for producing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1242US2014278812A1Diagnostics storage within a multi-tenant data centerMICROSOFT CORP·Filed 2013·Application pending·0 cites
- 1342US2007252261A1Semiconductor device packageWANG MENG-JEN·Filed 2006·Application pending·0 cites
- 1440US9726488B2Heading calibration method and compass sensor using the samePENG SHENG-YANG·Filed 2014·Granted Aug 8, 2017·0 cites·12 claims
- 1539US8501579B2Process of fabricating chipPENG SHENG-YANG·Filed 2010·Granted Aug 6, 2013·0 cites·16 claims
- 1635US2015025657A1Electronic devicePENG SHENG-YANG·Filed 2013·Application pending·0 cites
- 1732US2013161670A1Light emitting diode packages and methods of makingPENG SHENG-YANG·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →