Inventor · disambiguated record
Hidehisa Nasu
Also filed as: NASU HIDEHISA
4 granted patents·18 citations·filing 2005–2005
69Inventor score
Files withDENSO CORP4
Top patents by PatentIndex Score
4 records- 0180US7405107B2Semiconductor device, method and apparatus for fabricating the sameDENSO CORP·Filed 2005·Granted Jul 29, 2008·12 cites·6 claims
- 0273US7300274B2Change-over device for changing over between a heating medium and a resin material at a time of a secondary formingDENSO CORP·Filed 2005·Granted Nov 27, 2007·4 cites·13 claims
- 0363US7459118B2Heated medium supplying method and structure for secondary molding of resin molded componentDENSO CORP·Filed 2005·Granted Dec 2, 2008·1 cites·10 claims
- 0463US7438842B2Method of manufacturing resin molding and change-over device for changing over between heating medium and resin material in process of secondary formingDENSO CORP·Filed 2005·Granted Oct 21, 2008·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →