Inventor · disambiguated record
Paul H. Wermer
Also filed as: WERMER PAUL H
12 granted patents·692 citations·filing 1999–2006
94Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0198US6555906B2Microelectronic package having a bumpless laminated interconnection layerINTEL CORP·Filed 2000·Granted Apr 29, 2003·273 cites·14 claims
- 0295US6840777B2Solderless electronics packagingINTEL CORP·Filed 2000·Granted Jan 11, 2005·68 cites·34 claims
- 0395US6775150B1Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufactureINTEL CORP·Filed 2000·Granted Aug 10, 2004·70 cites·33 claims
- 0494US7067356B2Method of fabricating microelectronic package having a bumpless laminated interconnection layerINTEL CORP·Filed 2003·Granted Jun 27, 2006·79 cites·20 claims
- 0593US6605551B2Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductanceINTEL CORP·Filed 2000·Granted Aug 12, 2003·74 cites·27 claims
- 0689US6829133B2CapacitorINTEL CORP·Filed 2003·Granted Dec 7, 2004·41 cites·16 claims
- 0785US7120031B2Data processing system comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2004·Granted Oct 10, 2006·26 cites·3 claims
- 0883US7535728B2Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2006·Granted May 19, 2009·8 cites·15 claims
- 0983US7159313B2Solderless electronics packaging and methods of manufactureINTEL CORP·Filed 2004·Granted Jan 9, 2007·23 cites·34 claims
- 1069US7136275B2Polymeric dielectric material for high-energy density capacitorsINTEL CORP·Filed 2002·Granted Nov 14, 2006·11 cites·35 claims
- 1161US7348496B2Circuit board with organic dielectric layerINTEL CORP·Filed 2004·Granted Mar 25, 2008·7 cites·10 claims
- 1249US6480370B1Polymeric dielectric material for high-energy density capacitorsINTEL CORP·Filed 1999·Granted Nov 12, 2002·12 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →