Inventor · disambiguated record
Yoshimi Nakase
Also filed as: NAKASE YOSHIMI
16 granted patents·2 pending applications·524 citations·filing 1991–2005
95Inventor score
Top patents by PatentIndex Score
18 records- 0196US6703707B1Semiconductor device having radiation structureDENSO CORP·Filed 2000·Granted Mar 9, 2004·151 cites·57 claims
- 0291US6208231B1Stick-type ignition coil having improved structure against crack or dielectric dischargeDENSO CORP·Filed 1998·Granted Mar 27, 2001·53 cites·19 claims
- 0389US6693350B2Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structureDENSO CORP·Filed 2002·Granted Feb 17, 2004·56 cites·25 claims
- 0489US5170767AIgnition coil for internal combustion engineNIPPON DENSO CO·Filed 1991·Granted Dec 15, 1992·40 cites·11 claims
- 0585US7145254B2Transfer-molded power device and method for manufacturing transfer-molded power deviceDENSO CORP·Filed 2002·Granted Dec 5, 2006·45 cites·3 claims
- 0682US6998707B2Semiconductor device having radiation structureDENSO CORP·Filed 2003·Granted Feb 14, 2006·24 cites·2 claims
- 0782US6917103B2Molded semiconductor power device having heat sinks exposed on one surfaceDENSO CORP·Filed 2002·Granted Jul 12, 2005·33 cites·19 claims
- 0875US7215020B2Semiconductor device having metal plates and semiconductor chipDENSO CORP·Filed 2004·Granted May 8, 2007·22 cites·8 claims
- 0969US7247929B2Molded semiconductor device with heat conducting membersDENSO CORP·Filed 2004·Granted Jul 24, 2007·16 cites·14 claims
- 1069US7009292B2Package type semiconductor deviceDENSO CORP·Filed 2004·Granted Mar 7, 2006·16 cites·15 claims
- 1168US6930583B2Stick-type ignition coil having improved structure against crack or dielectric dischargeDENSO CORP·Filed 2003·Granted Aug 16, 2005·7 cites·13 claims
- 1267US7091603B2Semiconductor deviceDENSO CORP·Filed 2004·Granted Aug 15, 2006·13 cites·8 claims
- 1364US6538308B1Semiconductor apparatus with heat radiation structure for removing heat from semiconductor elementDENSO CORP·Filed 1999·Granted Mar 25, 2003·28 cites·24 claims
- 1462US7009284B2Semiconductor apparatus with heat radiation structure for removing heat from semiconductor elementDENSO CORP·Filed 2002·Granted Mar 7, 2006·10 cites·30 claims
- 1561US6995644B2Stick-type ignition coil having improved structure against crack or dielectric dischargeDENSO CORP·Filed 2005·Granted Feb 7, 2006·1 cites·20 claims
- 1660US7239016B2Semiconductor device having heat radiation plate and bonding memberDENSO CORP·Filed 2004·Granted Jul 3, 2007·9 cites·24 claims
- 1739US2005156324A1Method for manufacturing connection constructionDENSO CORP & TOYOTA JIDOSHA KA·Filed 2005·Application pending·0 cites
- 1836US2006055056A1Semiconductor equipment having a pair of heat radiation platesDENSO CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →