Inventor · disambiguated record
Edward A. Schrock
Also filed as: SCHROCK EDWARD · SCHROCK EDWARD A
20 granted patents·2 pending applications·1,175 citations·filing 1997–2007
96Inventor score
Top patents by PatentIndex Score
22 records- 0199US6048755AMethod for fabricating BGA package using substrate with patterned solder mask open in die attach areaMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 11, 2000·473 cites·20 claims
- 0297US6616864B1Z-axis electrical contact for microelectronic devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 9, 2003·107 cites·5 claims
- 0395US6210992B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·172 cites·18 claims
- 0493US6699928B2Adhesive composition for use in packaging applicationsMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 2, 2004·72 cites·16 claims
- 0591US6710456B1Composite interposer for BGA packagesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 23, 2004·51 cites·37 claims
- 0683US6770164B1Method for attaching a semiconductor die to a substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 3, 2004·29 cites·25 claims
- 0783US6541872B1Multi-layered adhesive for attaching a semiconductor die to a substrateMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 1, 2003·61 cites·35 claims
- 0881US6521980B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·25 cites·12 claims
- 0977US6825569B2BGA package having substrate with patterned solder mask defining open die attach areaMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 30, 2004·44 cites·7 claims
- 1073US5962862AMethod and apparatus for verifying the presence or absence of a componentMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 5, 1999·43 cites·21 claims
- 1170US6709896B1Methods for use in packaging applications using an adhesive compositionMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 23, 2004·15 cites·58 claims
- 1269US6770981B2Composite interposer for BGA packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 3, 2004·11 cites·33 claims
- 1365US6707152B1Semiconductor device, electrical conductor system, and method of makingMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 16, 2004·25 cites·19 claims
- 1465US6395579B2Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2001·Granted May 28, 2002·10 cites·9 claims
- 1559US6352925B1Method of making electrical conductor system for semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 5, 2002·7 cites·8 claims
- 1657US6646354B2Adhesive composition and methods for use in packaging applicationsMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 11, 2003·18 cites·31 claims
- 1752US7071030B2Method of making a flexible substrate with a filler materialMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 4, 2006·3 cites·24 claims
- 1848US2007166882A1Methods for fabricating chip-scale packages having carrier bondsJIANG TONGBI·Filed 2007·Application pending·0 cites
- 1943US6118080AZ-axis electrical contact for microelectronic devicesMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·7 cites·12 claims
- 2042US7213331B2Method for forming stencilMICRON TECHNOLOGY INC·Filed 2003·Granted May 8, 2007·0 cites·5 claims
- 2138US2002125568A1Method Of Fabricating Chip-Scale Packages And Resulting StructuresFiled 2000·Application pending·0 cites
- 2234US6662440B1Z-axis electrical contact for microelectric devicesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 16, 2003·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →