Inventor · disambiguated record
Tsutomu Mimata
Also filed as: MIMATA TSUTOMU
13 granted patents·3 pending applications·456 citations·filing 1975–2002
94Inventor score
Top patents by PatentIndex Score
16 records- 0198US4016855AGrinding methodHITACHI LTD·Filed 1975·Granted Apr 12, 1977·135 cites·10 claims
- 0287US6505397B1Die holding mechanism for a die with connecting wires thereonSHINKAWA KK·Filed 2000·Granted Jan 14, 2003·32 cites·3 claims
- 0387US5059559AMethod of aligning and bonding tab inner leadsHITACHI LTD·Filed 1988·Granted Oct 22, 1991·88 cites·21 claims
- 0474US4890780AManufacturing apparatusHITACHI LTD·Filed 1987·Granted Jan 2, 1990·40 cites·6 claims
- 0570US6760968B2Die packing deviceSHINKAWA KK·Filed 2001·Granted Jul 13, 2004·12 cites·3 claims
- 0669US6579057B2Conveyor apparatus for dies and small componentsSHINKAWA KK·Filed 2001·Granted Jun 17, 2003·13 cites·1 claims
- 0766US4950866AMethod and apparatus of bonding insulated and coated wireHITACHI LTD·Filed 1988·Granted Aug 21, 1990·38 cites·4 claims
- 0863US5015425AManufacturing apparatusHITACHI LTD·Filed 1989·Granted May 14, 1991·26 cites·6 claims
- 0963US4763827AManufacturing methodHITACHI LTD·Filed 1987·Granted Aug 16, 1988·28 cites·21 claims
- 1061US6383844B2Multi-chip bonding method and apparatusSHINKAWA KK·Filed 2000·Granted May 7, 2002·8 cites·3 claims
- 1159US4674670AManufacturing apparatusHITACHI LTD·Filed 1985·Granted Jun 23, 1987·25 cites·12 claims
- 1246US4405242AElectronic device and method of fabricating the sameHITACHI LTD·Filed 1981·Granted Sep 20, 1983·8 cites·10 claims
- 1337US2002129899A1Die pickup method and die pickup apparatusSHINKAWA KK·Filed 2002·Application pending·0 cites
- 1436US2002062916A1Method and apparatus for processing semiconductor pelletsSHINKAWA KK·Filed 2001·Application pending·0 cites
- 1535US2002037631A1Method for manufacturing semiconductor devicesSHINKAWA KK·Filed 2001·Application pending·0 cites
- 1632US4348751AElectronic device and method of fabricating the sameHITACHI LTD·Filed 1978·Granted Sep 7, 1982·3 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →