Inventor · disambiguated record
Ikuo Akai
Also filed as: AKAI IKUO
10 granted patents·3 pending applications·3 citations·filing 2007–2023
78Inventor score
Top patents by PatentIndex Score
13 records- 0181US10017591B21-butane-α-olefin copolymer compositionMITSUI CHEMICALS INC·Filed 2016·Granted Jul 10, 2018·1 cites·5 claims
- 0272US9505958B21-butene α-olefin copolymer compositionMITSUI CHEMICALS INC·Filed 2013·Granted Nov 29, 2016·1 cites·11 claims
- 0368US11753520B2Unsaturated polyester resin composition, molding material, and molded articleJAPAN COMPOSITE CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·5 claims
- 0467US2025197595A1Resin composition, molding material, and molded articleJAPAN COMPOSITE CO LTD·Filed 2023·Application pending·0 cites
- 0565US12435173B2Unsaturated polyester resin composition, molding material, and molded articleJAPAN COMPOSITE CO LTD·Filed 2020·Granted Oct 7, 2025·0 cites·5 claims
- 0659US8288479B2Propylene-based polymer, propylene-based polymer composition, pellet and pressure-sensitive adhesiveAKAI IKUO·Filed 2008·Granted Oct 16, 2012·1 cites·4 claims
- 0758US12215224B2Unsaturated polyester resin composition, molding material, molded article, and battery pack casing for electric vehicleJAPAN COMPOSITE CO LTD·Filed 2020·Granted Feb 4, 2025·0 cites·12 claims
- 0858US12037436B2Unsaturated polyester resin composition, molding material, molded article, and battery pack housing for electric vehiclesJAPAN COMPOSITE CO LTD·Filed 2019·Granted Jul 16, 2024·0 cites·10 claims
- 0955US2024278530A1Laminated productJAPAN COMPOSITE CO LTD·Filed 2022·Application pending·0 cites
- 1051US12448511B2Unsaturated polyester resin composition, molding material, molded article, and battery pack housing for electric vehiclesJAPAN COMPOSITE CO LTD·Filed 2019·Granted Oct 21, 2025·0 cites·14 claims
- 1146US11686365B2Cylinder device and rod manufacturing methodHITACHI ASTEMO LTD·Filed 2018·Granted Jun 27, 2023·0 cites·3 claims
- 1242US9566770B2Polyolefin composite filmAKAI IKUO·Filed 2011·Granted Feb 14, 2017·0 cites·9 claims
- 1338US2008020575A1Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheetMITSUI CHEMICALS INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →