Inventor · disambiguated record
Mark W. Holderman
Also filed as: HOLDERMAN MARK W
11 granted patents·4 pending applications·29 citations·filing 2019–2025
88Inventor score
Top patents by PatentIndex Score
15 records- 0196US11485523B2Folded packageMPI LLC·Filed 2021·Granted Nov 1, 2022·4 cites·19 claims
- 0294US11649077B2Folded package and method of formationMPI LLC·Filed 2022·Granted May 16, 2023·2 cites·18 claims
- 0392US11130596B2Folded packageMPI LLC·Filed 2019·Granted Sep 28, 2021·8 cites·20 claims
- 0491US11246336B2Folding station of a packaging apparatus and systemMPI LLC·Filed 2019·Granted Feb 15, 2022·6 cites·16 claims
- 0590US11148835B2Packaging apparatus and systemMPI LLC·Filed 2019·Granted Oct 19, 2021·6 cites·16 claims
- 0688US11794438B2Packaging apparatus, system, and method for forming filled conesHOLDERMAN MARK W·Filed 2020·Granted Oct 24, 2023·2 cites·11 claims
- 0788US11414221B2Packaging apparatus, system, and method for forming filled conesHOLDERMAN MARK W·Filed 2022·Granted Aug 16, 2022·1 cites·13 claims
- 0884US11945611B2Folded package and method of formationMPI LLC·Filed 2023·Granted Apr 2, 2024·0 cites·19 claims
- 0983US2023354882A1Packer Station of a Packaging Apparatus and SystemMPI LLC·Filed 2023·Application pending·0 cites
- 1082US2025262835A1Packaging apparatus, system, and method for forming filled conesMPI LLC·Filed 2025·Application pending·0 cites
- 1181US12319024B2Packaging apparatus, system, and method for forming filled conesMPI LLC·Filed 2023·Granted Jun 3, 2025·0 cites·12 claims
- 1274US2024268448A1Packaging apparatus, system, and method for forming filled conesMPI LLC·Filed 2024·Application pending·0 cites
- 1369US12004557B2Packaging apparatus, system, and method for forming filled conesMPI LLC·Filed 2021·Granted Jun 11, 2024·0 cites·6 claims
- 1465US2025340320A1Heat shrink packaging systemHOLDERMAN MARK W·Filed 2025·Application pending·0 cites
- 1552US11918032B2Packer station of a packaging apparatus and systemMPI LLC·Filed 2019·Granted Mar 5, 2024·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →