Inventor · disambiguated record
Rao R. Tummala
Also filed as: TUMMALA RAO · TUMMALA RAO O · TUMMALA RAO R · TUMMALA RAO RAMAMOHANA
31 granted patents·11 pending applications·900 citations·filing 1975–2024
97Inventor score
Files withGEORGIA TECH RES INST16IBM12LEE BAIK-WOO2PULUGURTHA MARKONDEYARAJ2RAJ PULUGURTHA MARKONDEYA2
Top patents by PatentIndex Score
42 records- 0195US4301324AGlass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copperIBM·Filed 1978·Granted Nov 17, 1981·107 cites·8 claims
- 0295US4234367AMethod of making multilayered glass-ceramic structures having an internal distribution of copper-based conductorsIBM·Filed 1979·Granted Nov 18, 1980·91 cites·16 claims
- 0394US4221047AMultilayered glass-ceramic substrate for mounting of semiconductor deviceIBM·Filed 1979·Granted Sep 9, 1980·178 cites·13 claims
- 0493US8536695B2Chip-last embedded interconnect structuresLIU FUHAN·Filed 2012·Granted Sep 17, 2013·57 cites·26 claims
- 0592US9275934B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameSUNDARAM VENKATESH·Filed 2011·Granted Mar 1, 2016·43 cites·17 claims
- 0692US9167694B2Ultra-thin interposer assemblies with through viasSUNDARAM VENKATESH V·Filed 2011·Granted Oct 20, 2015·24 cites·26 claims
- 0789US4413061AGlass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copperIBM·Filed 1981·Granted Nov 1, 1983·73 cites·20 claims
- 0888US10672718B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameGEORGIA TECH RES INST·Filed 2016·Granted Jun 2, 2020·6 cites·18 claims
- 0988US9417415B2Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrateGEORGIA TECH RES INST·Filed 2014·Granted Aug 16, 2016·9 cites·9 claims
- 1088US8335084B2Embedded actives and discrete passives in a cavity within build-up layersLEE BAIK-WOO·Filed 2006·Granted Dec 18, 2012·27 cites·9 claims
- 1187US3966449ASealing glass composition and processIBM·Filed 1975·Granted Jun 29, 1976·46 cites·3 claims
- 1285US4224627ASeal glass for nozzle assemblies of an ink jet printerIBM·Filed 1979·Granted Sep 23, 1980·28 cites·11 claims
- 1384US7262075B2High-aspect-ratio metal-polymer composite structures for nano interconnectsGEORGIA TECH RES INST·Filed 2005·Granted Aug 28, 2007·10 cites·14 claims
- 1478US5196251ACeramic substrate having a protective coating thereon and a method for protecting a ceramic substrateIBM·Filed 1991·Granted Mar 23, 1993·67 cites·29 claims
- 1576US8970036B2Stress relieving second level interconnect structures and methods of making the sameRAJ PULUGURTHA MARKONDEYA·Filed 2011·Granted Mar 3, 2015·6 cites·7 claims
- 1676US6261941B1Method for manufacturing a multilayer wiring substrateGEORGIA TECH RES INST·Filed 1999·Granted Jul 17, 2001·50 cites·22 claims
- 1774US12315787B2Embedded semiconductor packages and methods thereofGEORGIA TECH RES INST·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 1873US3975175AProcess for increasing the strength of sealing glassIBM·Filed 1975·Granted Aug 17, 1976·28 cites·8 claims
- 1967US8084841B2Systems and methods for providing high-density capacitorsPULUGURTHA MARKONDEYARAJ·Filed 2009·Granted Dec 27, 2011·6 cites·37 claims
- 2062US7556189B2Lead-free bonding systemsGEORGIA TECH RES INST·Filed 2005·Granted Jul 7, 2009·1 cites·18 claims
- 2159US7557448B2High-aspect-ratio metal-polymer composite structures for nano interconnectsGEORGIA TECH RES INST·Filed 2007·Granted Jul 7, 2009·5 cites·20 claims
- 2257US12027453B2Embedded semiconductor packages and methods thereofGEORGIA TECH RES INST·Filed 2020·Granted Jul 2, 2024·0 cites·31 claims
- 2357US8174017B2Integrating three-dimensional high capacitance density structuresPULUGURTHA MARKONDEYA RAJ·Filed 2006·Granted May 8, 2012·3 cites·15 claims
- 2456US9173282B2Interconnect structures and methods of making the sameRAJ PULUGURTHA MARKONDEYA·Filed 2011·Granted Oct 27, 2015·1 cites·11 claims
- 2556US8633601B2Interconnect assemblies and methods of making and using sameKUMBHAT NITESH·Filed 2010·Granted Jan 21, 2014·2 cites·19 claims
- 2653US2023215762A1Methods for etch barrier deposition and devices made according to the sameGEORGIA TECH RES INST·Filed 2023·Application pending·0 cites
- 2749US4122460AInk jet nozzle structuresIBM·Filed 1977·Granted Oct 24, 1978·10 cites·3 claims
- 2845US5304517AToughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sinteringIBM·Filed 1993·Granted Apr 19, 1994·11 cites·7 claims
- 2943US7977758B2Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architecturesGEORGIA TECH RES INST·Filed 2008·Granted Jul 12, 2011·0 cites·15 claims
- 3042US11756985B2Substrate-compatible inductors with magnetic layersGEORGIA TECH RES INST·Filed 2017·Granted Sep 12, 2023·0 cites·30 claims
- 3142US2014347157A1Magnetic device utilizing nanocomposite films layered with adhesivesGEORGIA TECH RES INST·Filed 2012·Application pending·0 cites
- 3239US3982918AProcess for preparing a copper containing sealing glassIBM·Filed 1975·Granted Sep 28, 1976·8 cites·5 claims
- 3338US2014145328A1Interconnect assemblies and methods of making and using sameGEORGIA TECH RES INST·Filed 2014·Application pending·0 cites
- 3438US2006269762A1Reactively formed integrated capacitors on organic substrates and fabrication methodsPULUGURTHA MARKONDEYA R·Filed 2006·Application pending·0 cites
- 3537US2010284123A1Systems and methods for fabricating high-density capacitorsPULUGURTHA MARKONDEYARAJ·Filed 2009·Application pending·0 cites
- 3636US2012261805A1Through package via structures in panel-based silicon substrates and methods of making the sameSUNDARAM VENKATESH V·Filed 2012·Application pending·0 cites
- 3734US4504340AMaterial and process set for fabrication of molecular matrix print headIBM·Filed 1983·Granted Mar 12, 1985·3 cites·9 claims
- 3834US2016109653A1Optical interconnects and methods of fabricating sameGEORGIA TECH RES INST·Filed 2015·Application pending·0 cites
- 3934US2006211171A1Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced therebyTUMMALA RAO O·Filed 2006·Application pending·0 cites
- 4033US2016113108A1Package-level electromagnetic interference shielding structures for a substrateGEORGIA TECH RES INST·Filed 2015·Application pending·0 cites
- 4133US2006258327A1Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materialsLEE BAIK-WOO·Filed 2006·Application pending·0 cites
- 4229US2016111380A1New structure of microelectronic packages with edge protection by coatingGEORGIA TECH RES INST·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →