Inventor · disambiguated record
Kuo-Chin Hung
Also filed as: HUNG KUO-CHIN
13 granted patents·6 pending applications·23 citations·filing 2005–2022
87Inventor score
Top patents by PatentIndex Score
19 records- 0189US9640482B1Semiconductor device with a contact plug and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 2, 2017·6 cites·20 claims
- 0286US9887158B1Conductive structure having an entrenched high resistive layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·5 cites·11 claims
- 0382US9853123B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 26, 2017·4 cites·28 claims
- 0477US9755047B2Semiconductor process and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 5, 2017·2 cites·3 claims
- 0576US9735015B1Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·2 cites·19 claims
- 0674US9502303B2Method for manufacturing semiconductor device with a barrier layer having overhung portionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·2 cites·19 claims
- 0772US10388788B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 20, 2019·2 cites·14 claims
- 0871US11705492B2Method for fabricating semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 18, 2023·0 cites·10 claims
- 0964US11031477B2Method for fabricating semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 8, 2021·0 cites·12 claims
- 1057US10541309B2Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 21, 2020·0 cites·7 claims
- 1153US10192826B2Conductive layout structure including high resistive layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·8 claims
- 1253US9985110B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·0 cites·9 claims
- 1351US2009109822A1External storage module and shock absorption element thereofASUSTEK COMP INC·Filed 2008·Application pending·0 cites
- 1449US12066876B2Electronic system with a cooling device with at least a pressing portionASUSTEK COMP INC·Filed 2022·Granted Aug 20, 2024·0 cites·8 claims
- 1544US2016013100A1Via structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1643US2015331218A1Lens and method of producing the sameCALIN TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1740US2015331219A1Lens assemblyCALIN TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1833US2007062451A1Stabilizing system for film depositionHSU WEN-CHENG·Filed 2005·Application pending·0 cites
- 1932US2016336269A1Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →