Inventor · disambiguated record
Jae Suk Park
Also filed as: PARK JAE SUK
10 granted patents·9 pending applications·29 citations·filing 2009–2025
84Inventor score
Files withHYUNDAI MOTOR CO LTD12AGASEMICON CORP2LIGHTIZER CO LTD2PARK JAE SUK1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
19 records- 0185US9145821B2Engine having multi flow rate control valveHYUNDAI MOTOR CO LTD·Filed 2014·Granted Sep 29, 2015·8 cites·10 claims
- 0284US9175584B2Sintered alloy for valve seat and manufacturing method of exhaust valve seat using the sameHYUNDAI MOTOR CO LTD·Filed 2012·Granted Nov 3, 2015·6 cites·6 claims
- 0382US8973537B2Engine having thermostat and system thereofHYUNDAI MOTOR CO LTD·Filed 2013·Granted Mar 10, 2015·6 cites·13 claims
- 0465US9574486B2Control system of electrical thermostat and the system thereofHYUNDAI MOTOR CO LTD·Filed 2012·Granted Feb 21, 2017·2 cites·14 claims
- 0565US9062592B2Glow plug and electric thermostat with the sameHYUNDAI MOTOR CO LTD·Filed 2012·Granted Jun 23, 2015·2 cites·17 claims
- 0664US8166954B2Lubrication apparatus of fuel pump driven by fuel pump drive camPARK JAE SUK·Filed 2009·Granted May 1, 2012·5 cites·10 claims
- 0763US12464857B2Transfer resin for transferring an LED chip, and an apparatus for transferring an LED chip by using the sameAGASEMICON CORP·Filed 2022·Granted Nov 4, 2025·0 cites·17 claims
- 0860US10400661B2Engine cooling system, electronic thermostat control system and control method for the sameHYUNDAI MOTOR CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·2 claims
- 0959US2025366257A1Transfer resin for transferring an led chip, and an apparatus for transferring an led chip by using the sameAGASEMICON CORP·Filed 2025·Application pending·0 cites
- 1051US9759121B2Engine cooling system, electronic thermostat control system and control method for the sameHYUNDAI MOTOR CO LTD·Filed 2013·Granted Sep 12, 2017·0 cites·13 claims
- 1150US10900440B2Flow control valve and cooling circuit for vehicles with flow control valveHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jan 26, 2021·0 cites·2 claims
- 1246US2015133045A1Front panel of indoor unit and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1345US2014137567A1Micro gas turbine having ignitor-coupling structurer and method of assembling the sameSTX HEAVY IND CO LTD·Filed 2013·Application pending·0 cites
- 1445US2014345547A1Cooling system of engineHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
- 1543US2013263800A1Electronic thermostatHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
- 1640US2022199882A1Light emitting diode chip-scale package and method for manufacturing sameLIGHTIZER CO LTD·Filed 2020·Application pending·0 cites
- 1740US2013263801A1ThermostatHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
- 1839US2022254673A1A photosensitive transfer resin for transferring an led chip, a method of transferring an led chip using the photosensitive transfer resin, and a method of manufacturing a display device using the sameLIGHTIZER CO LTD·Filed 2021·Application pending·0 cites
- 1939US2014097259A1ThermostatHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →