Inventor · disambiguated record
Kyungsuk Oh
Also filed as: OH KYUNGSUK
15 granted patents·7 pending applications·16 citations·filing 2019–2025
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD22
Top patents by PatentIndex Score
22 records- 0191US12009303B2Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·5 cites·20 claims
- 0291US11984421B2Integrated circuit chip having BS-PDN structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·3 cites·20 claims
- 0389US11631660B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 18, 2023·2 cites·18 claims
- 0485US11101243B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·20 claims
- 0579US11482516B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·16 claims
- 0676US12237268B2Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 0775US2025096061A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0871US11996398B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 0971US10699056B1Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 30, 2020·1 cites·20 claims
- 1066US12199002B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·15 claims
- 1166US2025157930A1Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1265US12211829B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1365US11742329B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1457US12388048B2Semiconductor package comprising heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 1554US2024014166A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1653US12057441B2Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1753US2023307318A1Semiconductor package and cooling system thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1852US2024186290A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1951US2024282750A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2050US2023178450A1Film packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2149US11257786B2Semiconductor package including molding member, heat dissipation member, and reinforcing memberSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·19 claims
- 2247US11482507B2Semiconductor package having molding member and heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →