Inventor · disambiguated record
Koudai Moroiwa
Also filed as: MOROIWA KOUDAI
2 granted patents·1 pending application·1 citations·filing 2009–2025
33Inventor score
Top patents by PatentIndex Score
3 records- 0167US2025357186A1Method for producing support substrate for bonded wafer, and support substrate for bonded waferSUMCO CORP·Filed 2025·Application pending·0 cites
- 0257US12400909B2Method for producing support substrate for bonded wafer, and support substrate for bonded waferSUMCO CORP·Filed 2021·Granted Aug 26, 2025·0 cites·5 claims
- 0341US8662961B2Polishing pad seasoning method, seasoning plate, and semiconductor polishing deviceMARUOKA DAISUKE·Filed 2009·Granted Mar 4, 2014·1 cites·23 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →