Inventor · disambiguated record
Seiji Nagatani
Also filed as: NAGATANI SEIJI
7 granted patents·49 citations·filing 2001–2009
81Inventor score
Top patents by PatentIndex Score
7 records- 0181US7883783B2Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring boardMITSUI MINING & SMELTING CO·Filed 2005·Granted Feb 8, 2011·12 cites·10 claims
- 0271US8187722B2Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheetNAGATANI SEIJI·Filed 2007·Granted May 29, 2012·7 cites·18 claims
- 0368US7691487B2Electrodeposited copper foil with carrier foilMITSUI MINING & SMELTING CO·Filed 2003·Granted Apr 6, 2010·26 cites·10 claims
- 0465US7851053B2Copper clad laminateMITSUI MINING & SMELTING CO·Filed 2008·Granted Dec 14, 2010·0 cites·15 claims
- 0563US7749610B2Copper foil and method of manufacturing the sameMITSUI MINING & SMELTING CO·Filed 2005·Granted Jul 6, 2010·2 cites·3 claims
- 0647US7358189B2Copper clad laminateMITSUI MINING & SMELTING CO·Filed 2001·Granted Apr 15, 2008·2 cites·19 claims
- 0745US8394509B2Surface-treated copper foilNAGATANI SEIJI·Filed 2009·Granted Mar 12, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →