Inventor · disambiguated record
Shafidul Islam
Also filed as: ISLAM SHAFIDUL
15 granted patents·1 pending application·614 citations·filing 1987–2010
94Inventor score
Files withUNISEM MAURITIUS HOLDINGS LTD8ADVANCED INTERCONNECT TECH LTD4ISLAM SHAFIDUL1SAN ANTONIO ROMARICO SANTOS1TEXAS INSTRUMENTS INC1
Top patents by PatentIndex Score
16 records- 0198US6812552B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2002·Granted Nov 2, 2004·264 cites·12 claims
- 0297US7262491B2Die pad for semiconductor packages and methods of making and using sameADVANCED INTERCONNECT TECH LTD·Filed 2005·Granted Aug 28, 2007·89 cites·18 claims
- 0395US7622332B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2005·Granted Nov 24, 2009·36 cites·12 claims
- 0492US7129116B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Oct 31, 2006·41 cites·11 claims
- 0586US7820480B2Lead frame routed chip pads for semiconductor packagesUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Oct 26, 2010·12 cites·8 claims
- 0686US7709935B2Reversible leadless package and methods of making and using sameUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted May 4, 2010·39 cites·12 claims
- 0785US6777265B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2003·Granted Aug 17, 2004·43 cites·13 claims
- 0882US8058104B2Reversible leadless package and methods of making and using sameISLAM SHAFIDUL·Filed 2010·Granted Nov 15, 2011·8 cites·6 claims
- 0975US7795710B2Lead frame routed chip pads for semiconductor packagesUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted Sep 14, 2010·19 cites·14 claims
- 1072US7563648B2Semiconductor device package and method for manufacturing sameUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted Jul 21, 2009·23 cites·33 claims
- 1168US7439097B2Taped lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2005·Granted Oct 21, 2008·4 cites·7 claims
- 1264US7554180B2Package having exposed integrated circuit deviceUNISEM MAURITIUS HOLDINGS LTD·Filed 2003·Granted Jun 30, 2009·11 cites·6 claims
- 1359US8304864B2Lead frame routed chip pads for semiconductor packagesSAN ANTONIO ROMARICO SANTOS·Filed 2010·Granted Nov 6, 2012·2 cites·58 claims
- 1458US8053869B2Package having exposed integrated circuit deviceUNISEM MAURITIUS HOLDINGS LTD·Filed 2009·Granted Nov 8, 2011·1 cites·11 claims
- 1552US4812114ANew IC molding processTEXAS INSTRUMENTS INC·Filed 1987·Granted Mar 14, 1989·22 cites·13 claims
- 1635US2004058478A1Taped lead frames and methods of making and using the same in semiconductor packagingFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →