Inventor · disambiguated record
Seiki Hiramatsu
Also filed as: HIRAMATSU SEIKI
14 granted patents·1 pending application·118 citations·filing 2001–2020
90Inventor score
Files withMITSUBISHI ELECTRIC CORP8HIRAMATSU SEIKI3HIROSE ELECTRIC CO LTD1MIMURA KENJI1TERAI MAMORU1
Top patents by PatentIndex Score
15 records- 0190US6934450B2Optical path-changing connectorMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Aug 23, 2005·56 cites·17 claims
- 0284US7514782B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Apr 7, 2009·13 cites·11 claims
- 0376US6907173B2Optical path changing deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jun 14, 2005·18 cites·15 claims
- 0471US8193633B2Heat conductive sheet and method for producing same, and powder moduleMIMURA KENJI·Filed 2008·Granted Jun 5, 2012·6 cites·7 claims
- 0571US7488119B2Photoelectric composite connector and substrate using the sameHIROSE ELECTRIC CO LTD·Filed 2005·Granted Feb 10, 2009·13 cites·6 claims
- 0670US9029438B2Thermosetting resin composition, B-stage heat conductive sheet, and power moduleYAMAMOTO KEI·Filed 2010·Granted May 12, 2015·3 cites·18 claims
- 0763US9153512B2Semiconductor device with an insulating terminal tableTERAI MAMORU·Filed 2011·Granted Oct 6, 2015·2 cites·11 claims
- 0863US8236666B2Semiconductor device and process for producing sameHIRAMATSU SEIKI·Filed 2007·Granted Aug 7, 2012·3 cites·8 claims
- 0962US11476170B2Power semiconductor module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 18, 2022·1 cites·17 claims
- 1058US8222752B2Organopolysiloxane composition and semiconductor apparatusHIRAMATSU SEIKI·Filed 2010·Granted Jul 17, 2012·1 cites·6 claims
- 1156US9082707B2Semiconductor device and method for manufacturing semiconductor deviceHIRAMATSU SEIKI·Filed 2011·Granted Jul 14, 2015·1 cites·17 claims
- 1253US12224220B2Semiconductor module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 11, 2025·0 cites·13 claims
- 1343US11784105B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 10, 2023·0 cites·14 claims
- 1443US6700073B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 2, 2004·1 cites·11 claims
- 1539US2021391299A1Semiconductor device, method for manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →