Inventor · disambiguated record
Rong-Shen Lee
Also filed as: LEE RONG-SHEN
13 granted patents·4 pending applications·1,018 citations·filing 1996–2015
94Inventor score
Top patents by PatentIndex Score
17 records- 0196US6590282B1Stacked semiconductor package formed on a substrate and method for fabricationIND TECH RES INST·Filed 2002·Granted Jul 8, 2003·145 cites·11 claims
- 0296US5977626AThermally and electrically enhanced PBGA packageIND TECH RES INST·Filed 1998·Granted Nov 2, 1999·426 cites·28 claims
- 0394US6459150B1Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layerIND TECH RES INST·Filed 2000·Granted Oct 1, 2002·125 cites·9 claims
- 0494US5736785ASemiconductor package for improving the capability of spreading heatIND TECH RES INST·Filed 1996·Granted Apr 7, 1998·192 cites·37 claims
- 0593US8810031B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2010·Granted Aug 19, 2014·27 cites·40 claims
- 0683US8164165B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2006·Granted Apr 24, 2012·10 cites·35 claims
- 0783US6479321B2One-step semiconductor stack packaging methodIND TECH RES INST·Filed 2001·Granted Nov 12, 2002·38 cites·46 claims
- 0878US9111774B2Wafer-to-wafer stack with supporting postIND TECH RES INST·Filed 2013·Granted Aug 18, 2015·3 cites·35 claims
- 0974US6536653B2One-step bumping/bonding method for forming semiconductor packagesIND TECH RES INST·Filed 2001·Granted Mar 25, 2003·21 cites·27 claims
- 1071US8243966B2Assembly structure of a flat speakerLIN YU-MIN·Filed 2009·Granted Aug 14, 2012·5 cites·45 claims
- 1159US7948072B2Wafer-to-wafer stackingIND TECH RES INST·Filed 2008·Granted May 24, 2011·1 cites·19 claims
- 1257US6166435AFlip-chip ball grid array package with a heat slugIND TECH RES INST·Filed 1998·Granted Dec 26, 2000·25 cites·17 claims
- 1355US8280081B2Electrode connection structure of speaker unitLIN YU-MIN·Filed 2008·Granted Oct 2, 2012·0 cites·21 claims
- 1450US2012321108A1Electrode connection structure of speaker unitLIN YU-MIN·Filed 2012·Application pending·0 cites
- 1549US2015097259A1Conductive via structure, package structure, and package of photosensitive deviceIND TECH RES INST·Filed 2014·Application pending·0 cites
- 1648US2012178212A1Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2012·Application pending·0 cites
- 1742US2016043239A1Package structureIND TECH RES INST·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →