Inventor · disambiguated record
Ming Hua Du
Also filed as: DU MING HUA
7 granted patents·8 citations·filing 2017–2021
73Inventor score
Files withUNITED MICROELECTRONICS CORP4HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD2QING DING PREC ELECTRONICS HUAIAN CO LTD1
Top patents by PatentIndex Score
7 records- 0190US10681824B1Waterproof circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Jun 9, 2020·8 cites·19 claims
- 0271US11476367B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 18, 2022·0 cites·8 claims
- 0359US11133418B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 28, 2021·0 cites·8 claims
- 0455US11246225B2Circuit board with high reflectivity and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2020·Granted Feb 8, 2022·0 cites·10 claims
- 0555US10340391B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 2, 2019·0 cites·8 claims
- 0643US9860977B1Transparent flexible printed circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD·Filed 2017·Granted Jan 2, 2018·0 cites·11 claims
- 0741US10510549B2Method of fabricating a metal layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 17, 2019·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Ming Hua Du files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →