Inventor · disambiguated record
Min-Seung Yoon
Also filed as: YOON MIN-SEUNG
10 granted patents·2 pending applications·95 citations·filing 2009–2021
89Inventor score
Top patents by PatentIndex Score
12 records- 0197US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0292US9343361B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·11 cites·16 claims
- 0391US11081440B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 3, 2021·7 cites·19 claims
- 0489US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 0586US8513802B2Multi-chip package having semiconductor chips of different thicknesses from each other and related deviceMA KEUM-HEE·Filed 2011·Granted Aug 20, 2013·14 cites·22 claims
- 0686US8373261B2Chip stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Feb 12, 2013·9 cites·15 claims
- 0777US8415804B2Semiconductor chip, method of fabricating the same, and stack module and memory card including the sameLEE HO-JIN·Filed 2009·Granted Apr 9, 2013·7 cites·28 claims
- 0873US8114772B2Method of manufacturing the semiconductor deviceLEE KYU-HA·Filed 2010·Granted Feb 14, 2012·6 cites·20 claims
- 0968US8183673B2Through-silicon via structures providing reduced solder spreading and methods of fabricating the sameHWANG SON-KWAN·Filed 2009·Granted May 22, 2012·5 cites·30 claims
- 1064US11705391B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 1146US2010144137A1Method of interconnecting chips using capillary motionSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1238US2013052760A1Method of inspecting and manufacturing a stack chip packageCHO SUNG-DONG·Filed 2012·Application pending·0 cites
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