Inventor · disambiguated record
Dong-Hyeon Jang
Also filed as: JANG DONG-HYEON
45 granted patents·22 pending applications·1,841 citations·filing 1998–2024
98Inventor score
Files withSAMSUNG ELECTRONICS CO LTD45SAMSUNG DISPLAY CO LTD7CHUNG HYUN-SOO3LEE HO JIN2LEE TEAK-HOON2
Top patents by PatentIndex Score
67 records- 0199US7276799B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 2, 2007·429 cites·10 claims
- 0298US7598607B2Semiconductor packages with enhanced joint reliability and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 6, 2009·101 cites·14 claims
- 0398US6607938B2Wafer level stack chip package and method for manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 19, 2003·394 cites·16 claims
- 0498US6187615B1Chip scale packages and methods for manufacturing the chip scale packages at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 13, 2001·364 cites·20 claims
- 0597US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0697US7537959B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 26, 2009·52 cites·10 claims
- 0795US8368231B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 5, 2013·12 cites·19 claims
- 0895US7262475B2Image sensor device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 28, 2007·30 cites·8 claims
- 0994US8743582B23D semiconductor deviceKANG UK-SONG·Filed 2011·Granted Jun 3, 2014·19 cites·36 claims
- 1094US6376279B1method for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 23, 2002·81 cites·12 claims
- 1193US8455301B2Method of fabricating stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2011·Granted Jun 4, 2013·25 cites·26 claims
- 1292US9343361B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·11 cites·16 claims
- 1391US8735276B2Semiconductor packages and methods of manufacturing the sameCHUNG HYUN-SOO·Filed 2012·Granted May 27, 2014·14 cites·20 claims
- 1489US10438899B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·5 cites·18 claims
- 1589US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 1689US9245827B23D semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·9 cites·21 claims
- 1787US7977156B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 12, 2011·11 cites·20 claims
- 1886US8637350B2Method of manufacturing chip-stacked semiconductor packageAHN JUNG-SEOK·Filed 2012·Granted Jan 28, 2014·9 cites·20 claims
- 1985US8362621B2Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 29, 2013·14 cites·30 claims
- 2085US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 2184US8637969B2Stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2013·Granted Jan 28, 2014·7 cites·10 claims
- 2283US6518675B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 11, 2003·26 cites·27 claims
- 2382US7545027B2Wafer level package having redistribution interconnection layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·11 cites·22 claims
- 2482US7274097B2Semiconductor package including redistribution pattern and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 25, 2007·11 cites·41 claims
- 2581US6555921B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 29, 2003·27 cites·12 claims
- 2680US11616116B2Display device including dummy lines overlapping connection linesSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Mar 28, 2023·1 cites·17 claims
- 2778US6586275B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 1, 2003·20 cites·18 claims
- 2876US7855144B2Method of forming metal lines and bumps for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 21, 2010·7 cites·15 claims
- 2976US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 3076US7196000B2Method for manufacturing a wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 27, 2007·20 cites·12 claims
- 3175US7592709B2Board on chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 22, 2009·5 cites·15 claims
- 3273US11031347B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 3372US6903451B1Chip scale packages manufactured at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 7, 2005·18 cites·32 claims
- 3471US7534656B2Image sensor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·2 cites·12 claims
- 3571US6836018B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 28, 2004·13 cites·17 claims
- 3670US9136260B2Method of manufacturing chip-stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 3769US8110922B2Wafer level semiconductor module and method for manufacturing the sameCHUNG HYUN-SOO·Filed 2009·Granted Feb 7, 2012·3 cites·15 claims
- 3864US11663954B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2021·Granted May 30, 2023·0 cites·13 claims
- 3964US7307340B2Wafer-level electronic modules with integral connector contactsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 11, 2007·11 cites·38 claims
- 4063US7224055B2Center pad type IC chip with jumpers, method of processing the same and multi chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 29, 2007·11 cites·20 claims
- 4161US7825495B2Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 2, 2010·2 cites·19 claims
- 4261US7300864B2Method for forming solder bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 27, 2007·9 cites·20 claims
- 4361US2009020878A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4460US11195449B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·13 claims
- 4560US2025176378A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 4658US2025133946A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 4758US2024334766A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 4855US7923296B2Board on chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 12, 2011·0 cites·6 claims
- 4951US2009184411A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 5051US2025212630A1Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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