Inventor · disambiguated record
Biswajit Sur
Also filed as: SUR BISWAJIT
16 granted patents·1 pending application·296 citations·filing 1999–2024
94Inventor score
Top patents by PatentIndex Score
17 records- 0193US11121301B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO INC·Filed 2018·Granted Sep 14, 2021·21 cites·16 claims
- 0292US6667548B2Diamond heat spreading and cooling technique for integrated circuitsINTEL CORP·Filed 2001·Granted Dec 23, 2003·99 cites·20 claims
- 0389US12207569B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO LLC·Filed 2023·Granted Jan 21, 2025·1 cites·20 claims
- 0488US7132313B2Diamond heat spreading and cooling technique for integrated circuitsINTEL CORP·Filed 2003·Granted Nov 7, 2006·66 cites·20 claims
- 0587US6724078B1Electronic assembly comprising solderable thermal interfaceINTEL CORP·Filed 2000·Granted Apr 20, 2004·46 cites·52 claims
- 0675US9218041B2Adaptive thermal control of electronic devicesINTEL CORP·Filed 2012·Granted Dec 22, 2015·4 cites·33 claims
- 0774US7220624B2Windowed package for electronic circuitryINTEL CORP·Filed 2005·Granted May 22, 2007·8 cites·6 claims
- 0867US11770982B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO LLC·Filed 2021·Granted Sep 26, 2023·0 cites·12 claims
- 0966US6860642B2Compact optical package with modular optical connectorINTEL CORP·Filed 2002·Granted Mar 1, 2005·12 cites·14 claims
- 1065US7091063B2Electronic assembly comprising solderable thermal interface and methods of manufactureINTEL CORP·Filed 2004·Granted Aug 15, 2006·11 cites·25 claims
- 1161US9176550B2Thermally downward scalable systemSUR BISWAJIT·Filed 2010·Granted Nov 3, 2015·2 cites·19 claims
- 1261US2025344614A1Modular Quantum Processor Configurations and Module Integration Plate with Inter-Module Connections for SameRIGETTI & CO LLC·Filed 2024·Application pending·0 cites
- 1355US7065273B2Wideband arrayed waveguide gratingINTEL CORP·Filed 2003·Granted Jun 20, 2006·4 cites·26 claims
- 1454US6982192B1High performance thermal interface curing process for organic flip chip packagesINTEL CORP·Filed 1999·Granted Jan 3, 2006·16 cites·18 claims
- 1553US6928200B2Ultra-thin polarization mode converters based on liquid crystal materialsINTEL CORP·Filed 2002·Granted Aug 9, 2005·3 cites·20 claims
- 1645US7174060B2Ultra-thin polarization mode converters based on liquid crystal materialsINTEL CORP·Filed 2005·Granted Feb 6, 2007·0 cites·16 claims
- 1744US7242088B2IC package pressure release apparatus and methodINTEL CORP·Filed 2000·Granted Jul 10, 2007·3 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →